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4 results on '"Im, Sunghoon"'

1. Content-Adaptive Style Transfer: A Training-Free Approach with VQ Autoencoders

Author

Gim, Jongmin, Park, Jihun, Lee, Kyoungmin, Im, Sunghoon, Goos, Gerhard, Series Editor, Hartmanis, Juris, Founding Editor, Bertino, Elisa, Editorial Board Member, Gao, Wen, Editorial Board Member, Steffen, Bernhard, Editorial Board Member, Yung, Moti, Editorial Board Member, Cho, Minsu, editor, Laptev, Ivan, editor, Tran, Du, editor, Yao, Angela, editor, and Zha, Hongbin, editor

Published
2025
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2. Rethinking LiDAR Domain Generalization: Single Source as Multiple Density Domains

Author

Kim, Jaeyeul, Woo, Jungwan, Kim, Jeonghoon, Im, Sunghoon, Goos, Gerhard, Series Editor, Hartmanis, Juris, Founding Editor, Bertino, Elisa, Editorial Board Member, Gao, Wen, Editorial Board Member, Steffen, Bernhard, Editorial Board Member, Yung, Moti, Editorial Board Member, Leonardis, Aleš, editor, Ricci, Elisa, editor, Roth, Stefan, editor, Russakovsky, Olga, editor, Sattler, Torsten, editor, and Varol, Gül, editor

Published
2025
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3. BurstM: Deep Burst Multi-scale SR Using Fourier Space with Optical Flow

Author

Kang, EungGu, Lee, Byeonghun, Im, Sunghoon, Jin, Kyong Hwan, Goos, Gerhard, Series Editor, Hartmanis, Juris, Founding Editor, Bertino, Elisa, Editorial Board Member, Gao, Wen, Editorial Board Member, Steffen, Bernhard, Editorial Board Member, Yung, Moti, Editorial Board Member, Leonardis, Aleš, editor, Ricci, Elisa, editor, Roth, Stefan, editor, Russakovsky, Olga, editor, Sattler, Torsten, editor, and Varol, Gül, editor

Published
2025
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4. Deployable electronics with enhanced fatigue resistance for crumpling and tension.

Author

Hong I, Roh Y, Cho J, Lee S, Kang M, Choi D, Gong D, An H, Lim D, Shin D, Park J, Kim C, Kim T, Kim M, Im S, Lee J, Lee G, Kim U, Ko SH, Koh JS, Kang D, and Han S

Abstract

Highly packable and deployable electronics offer a variety of advantages in electronics and robotics by facilitating spatial efficiency. These electronics must endure extreme folding during packaging and tension to maintain a rigid structure in the deployment state. Here, we present foldable and robustly deployable electronics inspired by Plantago, characterized by their tolerance to folding and tension due to integration of tough veins within thin leaf. The primary design approach for these electronics involves a high resistance to folding and tension, achieved through a thin multilayered electronic composite, which manages the neutral axis and incorporates tough Kevlar. The fabricated electronics can be folded up to 750,000 times without malfunctions and endure pulling an object 6667 times heavier than itself without stretching. Such robust electronics can be used as a deployable robot with sensor arrays, demonstrating practical applicability, as it maintains their mechanical and electrical properties during inflation from the packaged state.

Published
2025
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