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This article introduces a novel hole edge inspection and metrology technology by edge diffractometry, which occurs when light interacts with the hole edge. The proposed method allows for simultaneous characterization of hole part error and edge roughness conditions. Edge diffraction occurs as light bends at a sharp edge. Such a diffractive fringe pattern, the so-called interferogram, is directly related to edge geometry and roughness. Image-based diffractometry inspection technology was developed to capture the diffractive fringe patterns. The collected fringe patterns were analyzed through statistical feature extraction methods, and numerical results such as roundness index, concentricity, and via edge roughness (VER) were obtained. The results indicated that hole 1 had an average VER of 0.665 µm and a roundness index of 0.95, while hole 2 was measured an average VER of 0.753 µm and a roundness index of 0.96. Through-focus scanning optical microscopy (TSOM) was also utilized to perform three-dimensional characterization of hole features along the depth direction. As a result, the proposed method could characterize hole part error and evaluate its roughness conditions. This study showed the potential to be adapted for automatic optical inspection for advancing microelectronics and semiconductor packaging technology. [ABSTRACT FROM AUTHOR]