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People with schizophrenia are at a greater risk of poor physical health than the general population. This study investigated the annual incidence of physical illnesses after a new schizophrenia diagnosis, which has rarely been investigated in the literature. The authors collected data from Taiwan's National Health Insurance Research Database from January 1, 1996, to December 31, 2013, and enrolled 1910 patients with newly diagnosed schizophrenia cases aged 10–40 years and 7640 age- and sex-matched controls from the general population. They estimated the 1-year prevalence and annual incidence rate ratio (IRR) of specified physical diseases across 3 years in the schizophrenia group compared with the controls. Several physical illnesses were prevalent within 1 year of schizophrenia diagnosis. Regarding incident physical illnesses, patients had a moderate to strong risk of numerous physical illnesses (IRR > 3.0: ischemic heart disease, cerebrovascular disease, diabetes mellitus, and cancer; IRR 1.8–3.0: other forms of heart disease, vein and lymphatic diseases, pneumonia, chronic hepatic disease, and ulcer disease) within the first year after schizophrenia diagnosis. The IRRs of most physical illnesses declined over 3 years, except for that of cerebrovascular disease, which significantly increased (IRR > 3.0) over the 3 years after schizophrenia diagnosis. Cerebrovascular disease had a significant incidence risk (IRR > 3) persistently across the 3 years. Various comorbid physical illnesses can occur in the early stages of schizophrenia. Clinicians should consider these vulnerabilities to physical illnesses during the evaluation of patients with newly diagnosed schizophrenia by attempting to prevent, screen for, and manage them. [ABSTRACT FROM AUTHOR]

[Display omitted] • The TSIC model facilitates the design of complex interface composites with stiff and compliant materials. • Control of the tensile and shear interface thickness allows tuning of the composites' stiffness and strength, respectively. • Fracture analysis reveals non-columnar fractures as a key to enhancing interface hardening in TSICs. • UV curing during printing results in a gradient elastic modulus at stiff-soft interfaces, enhancing strength compared to non-UV-cured samples. The rapid growth of polyjet additive manufacturing has propelled the 3D printing of multi-material polymer composites toward unprecedented applications. Interfaces in such composites play a paramount role in determining mechanical performance. This study delves into the crucial role of interfaces, employing VeroWhite and Agilus30Black materials to scrutinize the tensile and shear properties of stiff-soft interfaces. By applying these layers strategically, composites with multi-oriented interfaces were created, revealing the impact of soft material thickness and orientation on stiffness and strength. We identified columnar and non-columnar fracture mechanisms, shedding light on their correlation with interface hardening. Nanoindentation tests unveil the local interface properties, emphasizing the gradient change in elastic modulus when printed on the x -axis and the sharp drop on the z -axis. These findings offer valuable insights into material selection and interface optimization, providing a roadmap for achieving tailored mechanical properties in complex interface composites. [ABSTRACT FROM AUTHOR]

[Display omitted] • dBPN/BPQD using sonoelectrochemical method is successfully prepared. • 5-9 defect, 5-7-7-5 defect, and 5-8-5 defect vacancies on the dBPN/BPQD are observed. • The mass activities of dBPN/BPQD and rGO as UA sensors are studied. • The sensitivity of dBPN/BPQD as UA sensor is 474.2 μA mM−1 cm−2. • The data using serum samples demonstrate the potential of dBPN/BPQD as a UA sensor. To maintain human health, the development of rapid uric acid (UA) sensing is crucial. In this study, defective black phosphorus nanosheets with black phosphorus quantum dots (dBPN/BPQDs) were successfully and rapidly prepared by sonoelectrochemical exfoliation. In this process, the intercalation of phosphate ions into the black phosphorus working electrode was improved by coupling ultrasonic radiation with a high intercalating potential (8 V vs. Ag/AgCl/3M). The dBPN/BPQDs with various vacancies (5–9 defects, 5-7-7-5 defects, and 5-8-5 defect vacancies) exhibited a remarkable mass activity ( j m , 1.22 × 10−3 mA μg−1) for uric acid oxidation, which was 5.92 times greater than that of reduced graphene oxide (rGO) (2.06 × 10−4 mA μg−1). In addition, the sensitivity of the dBPN/BPQD UA sensor was 474.2 μA mM−1 cm−2 in the linear analysis range of 0.1–1.3 mM. The sensitivity of the sensor was apparently higher than 67.7 μA mM−1cm−2 for rGO. The data from real sample experiments using serum showed that the dBPN/BPQD catalyst had high recoveries (97.3 %–100.2 %) and low related standard deviation (0.44 %–1.52 %). The dBPN/BPQDs exhibited the potential as an amperometric sensor to detect UA without needing enzymes. [ABSTRACT FROM AUTHOR]

[Display omitted] • SPNC with Cu 2 O/Cu(OH) 2 surface and (1 3 ¯ 2) high-index facet is successfully synthesized. • SPNC shows 31.10 m2 g−1 for surface area and successfully catalyze CO 2 RR. • SPNC shows remarkable selectivity (FE C2H4 = 55.3 %) for the production of C 2 H 4. • Cu 2 O/Cu(OH) 2 surface impact significantly on CO-CO dimer for production of C 2 H 4. In the production of C 2 H 4, a vital raw material in the synthesis of polyethylene and polyvinyl chloride, Cu 2 O is a highly promising catalyst with excellent Faradaic efficiency and selectivity. We propose a method involving the partial reduction of Cu(OH) 2 to Cu 2 O by sodium L-ascorbate for the synthesis of spherical and porous Cu 2 O nanocages (SPNCs) with a surface containing both Cu 2 O and Cu(OH) 2. High-resolution transmission electron microscopy and electron diffraction measurements revealed ∼ 3-nm pores and a (1 3 ¯ 2) high-index facet on the SPNC, respectively. As SPNCs have a porous structure, their specific surface area is greater (31.10 m2 g−1) than that (6.35 m2 g−1) of spherical Cu 2 O nanocrystals (SNCs) with solid interiors. Furthermore, SPNCs, when applied as electrocatalysts for catalysing the CO 2 reduction reaction (CO 2 RR), demonstrated remarkable mass activities (16.92 mA mg−1 at −1.15 V vs. reversible hydrogen electrode) for C 2 H 4 production, with a Faraday efficiency reaching an impressive 55.3 %. Stability test data showed a consistent CO 2 RR current density over 6 h, owing to the porous structure and the presence of both Cu(OH) 2 and Cu 2 O on the catalyst surface. Our proposed SPNC catalysts can be employed as effective CO 2 RR catalysts for producing C 2 H 4 , which may help in reducing the present reliance on petrochemical processes. [ABSTRACT FROM AUTHOR]

A series of TiAlCrSi X N coatings with various silicon contents were fabricated on Si(100) and 304 stainless steel substrates using a radiofrequency magnetron sputtering system, aiming to examine the effects of various Si content on wear behaviors at room temperature and 700 °C. The addition of silicon notably increased the coatings' hardness from 21 GPa to 29 GPa, attributed to significant compressive residual stress (−3.4 GPa) that inhibited dislocation movement. Room temperature wear tests revealed that wear rates varied between 0.6 and 3.7 (10−6mm3N−1 m−1) with increasing silicon content. The lowest wear rate is observed at a silicon content of 3.1 at.%, which is associated with an ideal residual stress of −1.2 GPa. This stress level played a crucial role in preventing crack propagation and delamination, thus enhancing wear protection. At 700 °C, the coatings' wear resistance was mainly governed by their oxidation resistance, with the most resistant coatings exhibiting wear rates from 1.6 to 4.4 (10−6mm3N−1 m−1). The silicon addition promoted the formation of an amorphous Si 3 N 4 phase, serving as an oxygen diffusion barrier, thus enhancing resistance to oxidation at elevated temperatures. The findings suggest that TiAlCrSiN coatings offer a promising solution for advanced tribological applications, demonstrating improved performance at temperatures up to 700 °C. • Conducted high-temperature ball-on-disk wear tests to evaluate the wear resistance of (TiAlCrSi X)N coatings. • Explored the crucial role of residual stress in enhancing wear resistance at room temperature. • Demonstrated significant improvement in high-temperature wear resistance through silicon incorporation into (TiAlCr)N coatings. [ABSTRACT FROM AUTHOR]

Freeze-casting is a widely recognized method for producing porous materials. However, in the typical freeze-casting process, the pore morphology is single, and the pore size is mostly distributed at the micrometer scale due to the limitation of the nature of ice dendrites. In this study, ice template and the 3D-printed template we integrated to develop the dual-templating process to fabricate gyroid-structured, hierarchically-porous hydroxyapatite scaffolds. Microstructural characterizations by SEM and micro-CT demonstrated that the average diameter of macro-porosity, micro-porosity, and average porosity of the dual-scale gyroid scaffolds were 667.4 ± 95.8 μm, 20.8 ± 5.7 μm, and 66%, respectively. The fish scale-derived hydroxyapatite (HAp) powder was utilized as the raw material due to the advantages of hydroxyapatite, including eco-friendly, bio-compatibility, non-toxicity, and high ion removal ability. Assuredly, the dual-scale hydroxyapatite scaffolds have greatly improved the permeability (445.6 ± 171.3 × 10−13 m2) and Pb (II) ion adsorption efficiency (>98%) compared to traditionally freeze-casted, single-scale ones. In summary, the dual-scale, gyroid-structured hydroxyapatite scaffolds have great potential to be applied in the industrious wastewater treatment field. • Developed dual-templating of hydroxyapatite gyroid scaffolds for heavy metal adsorption. • Optimized hierarchical structure by controlling sacrificial template thickness and freeze-casting cooling rates. • Dual-scale scaffold permeability exceeded single-scale by 30 times. [ABSTRACT FROM AUTHOR]

With the development of the artificial intelligence (AI) industries, electronic packaging is developing in the direction of high-density, high efficiency and multi-functionality. To realize the high density and tiny scale interconnection, application of microbumps is inevitable. Thus, the mechanical and thermal properties of intermetallic compounds (IMCs) become quite important as the proportion of IMC in the bump is greatly increased. In this study, three types of full IMCs bump, Cu/Sn-3.5Ag(SA)/Cu, Cu18Ni/SA/Cu and Cu18Ni18Zn/SA/Cu, were fabricated through transient liquid phase (TLP) bonding. The evolution of orientation and the sizes of the Cu 6 Sn 5 grain before and after long-term thermal aging were analyzed and compared. After long-term thermal aging, the full IMCs bump with Ni and Zn added into Cu substrate simultaneously maintained consistent structure. In addition, the unusual growth of network-like Cu 3 Sn was observed in Cu18Ni/SA/Cu. Furthermore, the mechanical test and fracture cross-section analysis were conducted to discuss the crack paths. The study focused on establish the correlation between microstructure and mechanical performance. Network-like Cu 3 Sn was considered to enhance the strength of interfaces. Finally, the full IMCs bump which demonstrated the extraordinary thermal stability provided a reliable microstructure for application. • The microstructure and shear performance of Cu/Sn3.5Ag/Cu, Cu-Ni/Sn3.5Ag/Cu and Cu-Ni-Zn/Sn3.5Ag/Cu full intermetallic structure were revealed. • The employment of Cu-Ni-Zn matrix can inhibit the formation of Cu 3 Sn layer after long-term thermal aging, showing good thermal stability. • The growth of network-like Cu 3 Sn only formed after aging, which enhances the strength of the interface between Cu 6 Sn 5 and Cu 3 Sn. • The correlation between fracture paths and grain structure is established. [ABSTRACT FROM AUTHOR]