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Using rig equipment a study was made of the temperature distribution across the thickness of a 460 mm periclase-spinel roof in an open hearth furnace in conditions of natural cooling, and also forced surface and deep cooling of the structure.

The available types of forced-air fans and control methods, their application to power transformers, and the advantages of each type for specific installations are discussed.

In modernizing older existing stations in connection with plant capacity addition programs, difficulties often are encountered in installing adequate generator outlet capacity for modern generators several times larger in rating than the older units being replaced. In some cases the use of forced-air cooling may be justified as a means of increasing cable capacity well beyond the self-cooled rating of the installation.

The results of stability tests of five different xenon arc lamps are presented. Some comments on arc wander and forced air cooling are given, and such currently established stabilization procedures as current regulation, overfilling of the slit, ``burning‐in'' of lamps, and feedback techniques are considered.

A high-energy physics device known as a Horn, which operates at 140,000 A and 8 kV, has unique problems in keeping it operationally serviced after being exposed to 300- to 400-GeV protons and 1 to 5 x 10$sup 13$ protons per pulse. A modular system consisting of two horns, one cooled by a pulsed water spray and the other by forced air cooling, along with their associated utilities and instrumentation, was designed for primary servicing using electric master-slave manipulators and TV viewing.

The feasibility of micromodule circuitry packaging in tactical digital equipment has been demonstrated by the design, fabrication, and test of MICROPAC (Micromodule Digital Processor And Computer). As a by-product of the MICROPAC program, equipment design techniques for the economical mounting and interconnection of and heat transfer from digital micromodules have been developed and are described herein. It is shown that the circuitry booklet technique of micromodule mounting and interconnection lends itself to efficient heat transfer by forced air cooling, provides for a high packaging density, and permits micromodule interconnection wiring without multilayer wiring. Techniques for the assembly, wiring, and maintenance of high-density digital micromodule equipment have also been developed and are described herein. Finally, it is shown how the 1958 concept of the micromodule as a technique for packaging individual electronic components is advancing toward the 1962 concept of the micromodule as a technique for packaging multiple integrated electronic or solid circuits. The mixture of both concepts or techniques in future militarized digital equipment offers the promise of completely micromodularized digital equipment of high-speed performance, high reliability, and small size at fabrication costs substantially less than those for currently available conventionally packaged digital equipments.

This paper deals with the effects of ambient air density on the weightflow of air delivered by an air moving device to a package requiring cooling, and shows the way in which this change in weightflow governs the component temperature rise above ambient temperature. A typical example indicating the use of the contained information is presented.