Search

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail.

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed.

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits.

High purity pinhole free films /parylene/ applicability as barrier coating to keep semiconductor surface free from moisture, ions and contaminants

Apollo 11 lunar dust and breccia micromorphology and surface characteristics implying weathering processes

Procaryotic and eucaryotic nannofossils localized in prePaleozoic microflora, noting radiometric age and association with stromatolites

Microstructure of Proterozoic nannofossils bracketed by dated granitic events compared with living Eucapsis of blue green Chroococcaceae algal family

The initial results of a study directed to the task of selecting suitable evaluation tests which can form the basis for guidelines for electrically insulated adhesives are given. The properties of adhesives considered to be of major importance for the proposed application are enumerated, with brief comments. Specific tests to determine the chemical and electrolytic corrosivity of adhesives to commonly used metallization systems, their long-term outgassing after cure, and their bond strengths under a variety of conditions are defined and discussed in detail.

Although it is generally accepted that the use of adhesives in the assembly of hybrid microcircuits offers advantages over other bonding methods, there currently does not exist a set of guidelines for the selection of adhesives which will insure that hybrid microcircuits assembled with them will meet the long use-life, high-reliability requirements of electronic equipment for space applications. This study was directed to the identification of the properties of electrically insulative adhesives that potentially could cause problems in such an application, and to the development of evaluation tests to quantify these properties and thus form the basis for establishing suitable guidelines and, ultimately, specifications. Bond strength, outgassing after cure, and corrosivity were selected for detailed attention since they are considered to be especially critical. Introductory discussion includes enumeration and brief comments on the properties of adhesives considered to be important for the proposed application, a general review of polymeric types of adhesives, and identification of the major types of adhesives commercially available and specifically designed for microelectronic use. The specific tests developed to evaluate bond strength, outgassing after cure, and corrosivity are discussed in detail, and comparative results obtained for selected adhesives representative of the major types are given.

The most favorable sites in which to study the associations between stromatolites and the algae responsible for them are places where a variety of stromatolites of possibly early diagenetic or primary silica occupy a layer of substantial thickness of little metamorphosed ancient sediments. One such place is in northwestern Queensland, Australia. Five cases of association between stromatolites and blue-green algal nannofossils were observed within a 100-m sequence of carbonate rocks in that area.