21 results on '"Dong, H.J."'
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2. Ultrasonic-based surface patterning and interfacial reaction of ZrO2 ceramics
3. In-situ formation of amorphous Al2O3 interphase during ultrasonic-assisted soldering process of ZrO2 ceramic and 1060Al using Sn filler at low temperature
4. Room-temperature direct bonding of ZrO2 ceramic and SiCP/Al composite using ultrasonic waves
5. The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles
6. A suppository kit for metronomic photodynamic therapy: The elimination of rectal cancer in situ
7. Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process
8. Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures
9. Study on Mechanical Response Model of Soft Tissue in the Clamping Process
10. Analytical method for computing assembly errors in modular antenna during on-orbit assembly
11. Surface Patterning of ZrO2 Ceramicsnum using Sn-Al Alloy at a Low Temperature
12. Crystal structure of crp protein from Gardnerella Vaginalis
13. Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures
14. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process
15. Distinct phenotypes distinguish the molecular classes of Angelman syndrome
16. Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process
17. Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering
18. Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process
19. Development of a cell immobilization technique for the conversion of polysialogangliosides to monosialotetrahexosylganglioside
20. Protective effect of deferiprone on damaged genetic material of mice induced by alum
21. The elimination efficacy of chelating agent deferiprone on urinary copper, zinc and manganese in aluminum-loaded rabbits
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