35 results on '"Amalu, Emeka H."'
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2. Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package
3. Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors
4. Critical methods of geopolymer feedstocks activation for suitable industrial applications
5. Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
6. Critical skills needs and challenges for STEM/STEAM graduates increased employability and entrepreneurship in the solar energy sector
7. Thermal control of crystalline silicon photovoltaic (c-Si PV) module using Docosane phase change material (PCM) for improved performance
8. Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
9. A review of technology, materials and R&D challenges of upper limb prosthesis for improved user suitability
10. Robust crystalline silicon photovoltaic module (c-Si PVM) for the tropical climate: Future facing the technology
11. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
12. Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications
13. Generating temperature cycle profile from in-situ climatic condition for accurate prediction of thermo-mechanical degradation of c-Si photovoltaic module
14. Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates
15. Thermo-mechanical deformation degradation of crystalline silicon photovoltaic (c-Si PV) module in operation
16. A review of photovoltaic module technologies for increased performance in tropical climate
17. Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage
18. Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies
19. Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method
20. Fatigue Responses of Three Main Configurations of Dynamic Power Cable Used in the Offshore Industry
21. Development of Stress Concentration Factors (Ktg, Ktn) Charts for Finite Length of Flat Plate with a Circular Hole in Tension
22. A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly
23. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
24. Comparing and Benchmarking Fatigue Behaviours of Various SAC Solders under Thermo-Mechanical Loading
25. Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing
26. Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections
27. Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient.
28. Effects of component stand-off height on reliability of solder joints in assembled electronic component.
29. High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height
30. Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling
31. Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations
32. High temperature reliability of lead-free solder joints in a flip chip assembly
33. Effect of Relative Density on Compressive Load Response of Crumpled Aluminium Foil Mesh.
34. Optimised solder interconnections in crystalline silicon (c-Si) photovoltaic modules for improved performance in elevated temperature climate
35. A review of technology, materials and R&D challenges of upper limb prosthesis for improved user suitability.
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