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Presents a company profile of Dynamic Hybrids Inc., a firm based in Syracuse, New York, led by Donald Hazelmyer, president, and Terry Barber, marketing manager. Focus of the firm in manufacturing technology-based, hybrid-integrated circuits and direct bond copper (DBC) products; Advantages to the type of technology the firm offers; DBC applications; Cost and patents of products; Clientele; Company history; Obstacles company has to overcome since its inception.

The article reports that the International Business Machines Corp. (IBM) has applied self-assembling nanotechnology to conventional chip manufacturing to build the next generation of computer chips in the U.S. According to chief scientist Dan Edelstein of IBM, the technique produces processors that are smaller, faster and consume less power than conventional chips. IMB will adopt the natural pattern-creating process to form trillions of holes to create insulating vacuums around the miles of nano-scale wires inside each computer chip. This process has been integrated with IBM's manufacturing line in East Fishkill, and it is expected to be incorporated into all IBM's manufacturing lines by 2009.

Focuses on concerns on the reliability of services by cable networks in the United States. Capital investments in enhancing quality of services of cable operators; Efficiency of microwave, standby power supplies and channel capacities; Relevance of hybrid fiber/coax architecture in the improvement of system reliability; Approaches to reliability.

The article reports that Intel Corp. is focusing its World Wide Web approach in 1996 on a scheme that allows users to effectively deliver video, audio and 3-D effects despite the slow speed of phone modems in the U.S. Key issues discussed include a description of the concept of hybrid applications and the need for Web sites to keep up with the times.