1. Improved Thermal Stability Observed in Ni-Based Ohmic Contacts to n-Type SiC for High-Temperature Applications
- Author
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Lisa M. Porter, Ariel Virshup, Fang Liu, Anita Lloyd Spetz, Dorothy Lukco, and Kristina Buchholt
- Subjects
high-temperature reliability ,Scanning electron microscope ,Analytical chemistry ,TEKNIKVETENSKAP ,02 engineering and technology ,01 natural sciences ,chemistry.chemical_compound ,silicon carbide ,transmission electron microscopy ,0103 physical sciences ,Materials Chemistry ,Silicon carbide ,TECHNOLOGY ,Thermal stability ,Electrical and Electronic Engineering ,Silicon oxide ,Ohmic contact ,Ohmic contacts ,010302 applied physics ,Auger electron spectroscopy ,Chemistry ,Contact resistance ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Electronic, Optical and Magnetic Materials ,Metallizing ,0210 nano-technology ,scanning electron microscopy - Abstract
The high-temperature stability of a Pt/TaSi2/Ni/SiC ohmic contact metallization scheme was characterized using a combination of current-voltage measurements, Auger electron spectroscopy, and transmission electron microscopy imaging and associated analytical techniques. Increasing the thicknesses of the Pt and TaSi2 layers promoted electrical stability of the contacts, which remained ohmic at 600A degrees C in air for the extent of heat treatment; the specific contact resistance showed only a gradual increase from an initial value of 5.2 x 10(-5) Omega cm(2). We observed a continuous silicon oxide layer in the thinner contact structures, which failed after 36 h of heating. Meanwhile, thicker contacts with enhanced stability contained a much lower oxygen concentration that was distributed across the contact layers, precluding the formation of an electrically insulating contact structure. The original publication is available at www.springerlink.com:Ariel Virshup, Fang Liu, Dorothy Lukco, Kristina Buchholt, Anita Lloyd Spetz and Lisa M Porter, Improved Thermal Stability Observed in Ni-Based Ohmic Contacts to n-Type SiC for High-Temperature Applications, 2011, JOURNAL OF ELECTRONIC MATERIALS, (40), 4, 400-405.http://dx.doi.org/10.1007/s11664-010-1449-0Copyright: Springer Science Business Mediahttp://www.springerlink.com/
- Published
- 2010