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Owing to the intrinsically wide bandgap and high uniformity, amorphous Ga2O3 (a-Ga2O3) has been illustrating a great industrial potential for large-area deep ultraviolet (UV) photosensor arrays. However, a seemingly irreconcilable contradiction between high responsivity and long persistent photoconductivity has hampered the growing pace of such devices. In this work, three-terminal InGaZnO (IGZO)/a-Ga2O3 dual-active-layer (DAL) transistors were developed to realize the ability of a-Ga2O3 as the active layer both in switching and sensing. Benefitting from the introduction of ultrathin IGZO electron reservoir and defect control of a-Ga2O3, the DAL device demonstrates more stable and superior gate-control capability with promising performance including high on/off ratio and field-effect mobility of ∼108 and 8.3 cm2/V⋅s, respectively, as well as a small sub-threshold swing (SS) of 0.36 V/dec. Under 254 nm UV illumination, the DAL device manifests a light-to-dark ratio of ∼108, a responsivity of 4.8 × 103 A W−1, a detectivity of 8 × 1015 Jones, and a UV/visible rejection ratio (R254/R400) of 64. The simultaneous achievement of deep UV photo-detection and transistor's switching performance in a-Ga2O3 material offers excellent potential for the construction of large-area active-matrix UV photosensor arrays with the simple and low-cost fabrication process. [ABSTRACT FROM AUTHOR]

A three‐terminal thin‐film transistor (TFT) architecture is essential for photodetectors to reach a good balance between high responsivity and fast response speed. Bottom‐gate amorphous Ga2O3 (a‐Ga2O3) TFTs are fabricated to boost their UV photodetection properties. During the device fabrication process, a simple chemical‐etching solution with the advantages of easy operation, low cost, and compatibility with traditional lithography process, is developed to selectively etch a‐Ga2O3 films. The a‐Ga2O3 channel etched device on Si manifests an effective suppression of the commonly observed gate leakage current. Meanwhile, a patterned a‐Ga2O3 TFT on quartz shows an excellent n‐type TFT performance with an on/off ratio as high as ≈107. It is further applied as a phototransistor, to diminish the persistent photoconductivity (PPC) effect while keeping a high responsivity (R) as well. Under the 254 nm UV illumination, the a‐Ga2O3 phototransistor demonstrates a high light‐to‐dark ratio of 5 × 107, a high responsivity of 5.67 × 103 A W−1, and a high detectivity of 1.87 × 1015 Jones. Remarkably, the PPC phenomenon in a‐Ga2O3 UV phototransistors is effectively suppressed by applying a positive gate pulse, which greatly shortens the decay time to 5 ms and offers a‐Ga2O3 possible inroads into imaging applications. [ABSTRACT FROM AUTHOR]

[Display omitted] • PDMS surface is wrinkled by using an rf-sputtered ZnO sacrificial layer. • The optimal power density of wrinkle TENG increases by 78.5 times than the flat one. • The simulation proves the wrinkled surface can promote TENGs' output performance. Triboelectric nanogenerators (TENG) can convert mechanical energy to electricity. Its conversion efficiency strongly depends on the contact area of the triboelectric materials. Here, a simple strategy is developed to wrinkle the surface of polydimethylsiloxane (PDMS) by using an rf-sputtered ZnO sacrificial layer. The resulting TENG device demonstrates improved triboelectric performance in contrast to its counterpart fabricated on a flat PDMS. The optimal open circuit voltage (V OC), short circuit current (I SC) and pulse output power density with matched external load are 170 V, 8.7 × 10-7 A and 189 μW/cm2, which are 8.9, 2.2 and 78.5 times higher than those of the flat device, respectively. This simple and efficient method may hopefully promote the application of TENG in the field of flexible wearable electronics. [ABSTRACT FROM AUTHOR]

Flexible transparent ZnO thin-film transistors (TFTs) have gained momentum during the last decade because of the increasingly emerging demands in flexible transparent displays and wearable electronics industry. However, the instability issue regarding a deviation of turn-on voltage under gate bias stress has remained unsettled, greatly impeding the progress towards practical applications. Here we present a solution to this problem by adopting a new dual-source device architecture to self-diagnose and pull back the deviated turn-on voltage. The dual-source TFTs were fabricated on PEN substrate by conventional UV photolithography with ZnO channel prepared by magnetron sputtering technique. By combining the presented device architecture with a rapid correction process, the turn-on voltage shift was reduced to 0.1 V under −15 V gate voltage bias stress of 5000 s, which favors low power consumption circuits by preventing the TFTs drifting from enhancement to depletion mode. To illustrate its unique working mechanism, device physics simulation, square-law model deduction and circuit current analysis were carried out. The methodology we developed enhances the stability of flexible transparent oxide TFTs and can be adapted in other microelectronic and optoelectronic devices. • Flexible fully transparent thin-film transistors are fabricated. • Novel dual-source transistor structure is presented. • The gate bias instability problem can be readily solved. • TCAD device simulation is conducted to study the working principle. [ABSTRACT FROM AUTHOR]