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1. Efficient Range Sensing Using Imperceptible Structured Light

2. Ensemble of Fully Convolutional Neural Network for Brain Tumor Segmentation from Magnetic Resonance Images

3. Three-Dimensional Mesh Steganography and Steganalysis: A Review.

4. SIMULATING FLOW AND HEAT TRANSFER IN A VARIETY OF DIESEL PARTICULATE FILTER POROUS STRUCTURES USING LATTICE BOLTZMANN METHOD.

5. FPGA implementation of digital 3-D image skeletonization algorithm for shape matching applications.

7. Multi-material additive and subtractive prosumer digital fabrication with a free and open-source convertible delta RepRap 3-D printer

8. 3D or 3-D: a study of terminology, usage and style.

9. 3-D Nonlinear Acoustic Inverse Scattering: Algorithm and Quantitative Results.

10. Relevance of Device Cross Section to Overcome Boltzmann Switching Limit in 3-D Junctionless Transistor.

11. Fully 3-D Numerical Investigation of Phenomena Occurring in Marine Magnetohydrodynamic Thrusters.

12. Expected Failures in 3-D Technology and Related Failure Analysis Challenges.

13. Transverse Velocity Effect on Hunt’s Flow.

14. Investigations on the Geometry Effects and Bias Configuration on the TID Response of nMOS SOI Tri-Gate Nanowire Field-Effect Transistors.

15. Experimental Evidence Toward Understanding Charge Pumping Signals in 3-D Devices With Poly-Si Channel.

16. Improved 3-D Analytical Model for Axial-Flux Eddy-Current Couplings With Curvature Effects.

17. Power Allocation and 3-D Placement for Floating Relay Supporting Indoor Communications.

18. Coupling Mitigation in 3-D Multiple-Stacked Devices.

19. A Portable 3-D Imaging FMCW MIMO Radar Demonstrator With a 24 x 24 Antenna Array for Medium-Range Applications.

20. Subgridded FDTD Modeling of Ground Penetrating Radar Scenarios Beyond the Courant Stability Limit.

21. Novel Reconfigurable 3-D Frequency Selective Surface.

22. An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via.

23. Multimodal Sensor Fusion for Low-Power Wearable Human Motion Tracking Systems in Sports Applications.

24. Line-of-sight based three-dimensional path following control for an underactuated robotic dolphin.

25. Dual-Band Dual-CP All-Metal Antenna With Large Signal Coverage and High Isolation Over Two Bands for Vehicular Communications.

26. Adjustment of Virtual Mannequins Through Anthropometric Measurements, Cluster Analysis, and Content-Based Retrieval, of 3-D Body Scans.

27. Computer Vision and Pattern Recognition Techniques for 2-D and 3-D MR Cerebral Cortical Segmentation (Part I): A State-of-the-Art Review.

28. Two-way multi-view 2-D/3-D display combining LC lens and HVxDP panel using novel pixel arrangement.

29. GAN‐MD: A myocarditis detection using multi‐channel convolutional neural networks and generative adversarial network‐based data augmentation.

30. Improved organs at risk segmentation based on modified U‐Net with self‐attention and consistency regularisation.

31. Accurate 3-D Position and Orientation Method for Indoor Mobile Robot Navigation Based on Photoelectric Scanning.

32. CAESAR: An Approach Based on Covariance Matrix Decomposition to Improve Multibaseline–Multitemporal Interferometric SAR Processing.

33. Model-Based Predictive Control of Weld Penetration in Gas Tungsten Arc Welding.

34. A Time-of-Flight 3-D Image Sensor With Concentric-Photogates Demodulation Pixels.

35. Face-Based Gradient Smoothing Point Interpolation Method Applied to 3-D Electromagnetics.

36. Analysis and Modeling of DC Current Crowding for TSV-Based 3-D Connections and Power Integrity.

37. Theoretical Study on the Rank of Integral Operators for Broadband Electromagnetic Modeling From Static to Electrodynamic Frequencies.

38. A Rigorous 3-D NAND Flash Cost Analysis.

39. Spatio-Temporal Disocclusion Filling Using Novel Sprite Cells.

40. Investigation on Cu TSV-Induced KOZ in Silicon Chips: Simulations and Experiments.

41. 3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-Chip.

42. A Robust 3-D Structure for Superjunction VDMOS Under Unclamped Inductive Switching Condition.

43. \MOS3: A New Physics-Based Explicit Compact Model for Lightly Doped Short-Channel Triple-Gate SOI MOSFETs.

44. Calculation of the 3-D Ionized Field Under HVDC Transmission Lines.

45. Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

46. Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance.

47. A Manufacturing Cost Model for 3-D Monolithic Memory Integrated Circuits.

48. Electron Optics Simulator: A Three-Dimensional Finite-Element Electron Gun and Collector Design Tool.

49. Web-Supported Chemistry Education: Design of an Online Tutorial for Learning Molecular Symmetry.

50. Fusion of Region and Boundary/Surface-Based Computer Vision and Pattern Recognition Techniques for 2-D and 3-D MR Cerebral Cortical Segmentation (Part-II): A State-of-the-Art Review.