1. Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems.
- Author
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Chen, Morgan Jikang, Anh-Vu Pham, Evers, Nicole, Kapusta, Chris, Iannotti, Joseph, Kornrumpf, William, and Maciel, John
- Subjects
MICROELECTROMECHANICAL systems ,ELECTROMECHANICAL devices ,ELECTRONIC equipment ,ELECTRONICS packaging ,POLYMERS ,CRYSTALLINE polymers ,MECHATRONICS ,PACKAGING ,BROADBAND communication systems - Abstract
We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package, we have designed and implemented a 2-bit true-time delay X-band phase shifter using commercially available microelectromechanical switches. The packaged phase shifter has a measured insertion loss of 2.45 ± 0.12 dB/bit at 10 GHz. The worst case phase variation of the phase shifter at 10 GHz is measured to less than 5°. We have also conducted temperature cycling (-65°C to 150 °C) and 85/85 to qualify the packaging structures. [ABSTRACT FROM AUTHOR]
- Published
- 2008
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