1. Heterogeneous diamond–TiC composites with high fracture toughness and electrical conductivity.
- Author
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Zhou, Liang, Li, Yuanyuan, Kou, Zili, Zheng, Linpeng, Li, Qian, Ma, Guolong, Zhang, Youjun, and He, Duanwei
- Subjects
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FRACTURE toughness , *ELECTRIC conductivity , *CERAMICS , *THERMAL properties , *THERMAL stability , *FRACTURE strength - Abstract
The concurrent enhancement of toughness, electrical conductivity, and thermal stability in polycrystalline diamond composites represents a formidable challenge. Here, a novel diamond-TiC composites (referred to as DTC) with high fracture toughness and conductivity were synthesized through a high-temperature and high-pressure reaction sintering process utilizing two precursors: diamond mixtures containing TiH 2 and Ti-coated diamonds. On the one hand, the inherent bonding and encasing of TiC onto the diamond matrix form a heterogeneous structure, providing high strength and excellent fracture toughness up to 11.6 MPa·m1/2. On the other hand, the established oxygen barrier and current pathway offer a thermal stability of 765 °C and high conductivity up to 837 S·m−1. Remarkably, this rare combination of mechanical, electrical, and thermal properties has been realized within a single material under relatively moderate sintering conditions, thus positioning diamond-TiC composites as a promising ceramic for electrical applications in high-stress environments. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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