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:In this study, Ag3Sn nanoparticles were synthesized using the redox method and incorporated into SAC305 solder at varymg mass ratios (0, 0. 1 %,0.15%,0.2%)to investigate their impact on the microstructure, wettabihty, and rehabihty of the solder. The physical phase and morphology of the Ag3Sn nanoparticles were characterized by X-ray diffractometer and scanning e!ectron microscope, whUe the microstructure of the solder jonis was observed using a metallograplic microscope. Subsequently, the solder jonis were aged at 150 C for different durations(0, 50, 100, 150, 200 h), and the interfacaal intermetalic compound (IMC) layer thickness was measured usng Image J software to caiculate the growth coefticienr. Resuits indicate that the addition of an appropriate amount ofAg3Sn nanoparticles to SAC305 solder enhances wettabiiity, refines the microstructure, and inhibits IMC layer growth. As aging progresses, the Cu6Sn5 nntermetanic compound layer transitions from scalloped to pknar, accompaned by the appearance of the Cu3Sn nntermetanic compound aye. The optimal performance was observed with the addition of 0. 15 w. % Ag3Sn nanopartides to SAC305 solder, r esulting n improved wettabiity(spreading area of 167. 447 mm2), minimal growth coefficient(0. 04), and enhanced microstructural refinement [ABSTRACT FROM AUTHOR]