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Your search keyword '"Zhang, Xue-Ao"' showing total 21 results
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21 results on '"Zhang, Xue-Ao"'

10. Enhanced thermal management in electronic devices through control-oriented structures.

Author

Cheng, Shujian, Guo, Xiaoxiao, Cai, Weiwei, Zhang, Yufeng, and Zhang, Xue-ao

Abstract

As electronic devices continue to shrink in size while increasing in power, the generation of significant waste heat has become a major obstacle to further progress. Effective thermal management is crucial for the ongoing development of electronic devices. One promising approach to tackle this challenge is by manipulating the orientation of materials to enhance their anisotropic thermal conductivity, thereby enabling efficient heat dissipation in electronic devices. This paper aims to provide a comprehensive review of various strategies used to prepare oriented materials and their applications in the field of electronic device thermal management. Additionally, the challenges associated with these processes are summarized, offering insights into the current limitations and potential areas for improvement. [ABSTRACT FROM AUTHOR]

Published
2024
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20. Effect of Nanoscale in SituInterface Welding on the Macroscale Thermal Conductivity of Insulating Epoxy Composites: A Multiscale Simulation Investigation

Author

Ding, Dongliang, Huang, Ruoyu, Peng, Bo, Xie, Yangyang, Nie, Haitao, Yang, Chenhui, Zhang, Qiuyu, Zhang, Xue-ao, Qin, Guangzhao, and Chen, Yanhui

Abstract

Insulating thermally conductive polymer composites are in great demand in integrated-circuit packages, for efficient heat dissipation and to alleviative short-circuit risk. Herein, the continuous oriented hexagonal boron nitride (h-BN) frameworks (o-BN@SiC) were prepared viaself-assembly and in situchemical vapor infiltration (CVI) interface welding. The insulating o-BN@SiC/epoxy (o-BN@SiC/EP) composites exhibited enhanced thermal conductivity benefited from the CVI-SiC-welded BN–BN interface. Further, multiscale simulation, combining first-principles calculation, Monte Carlo simulation, and finite-element simulation, was performed to quantitatively reveal the effect of the welded BN–BN interface on the heat transfer of o-BN@SiC/EP composites. Phonon transmission in solders and phonon–phonon coupling of filler–solder interfaces enhanced the interfacial heat transfer between adjacent h-BN microplatelets, and the interfacial thermal resistance of the dominant BN–BN interface was decreased to only 3.83 nK·m2/W from 400 nK·m2/W, plunging by over 99%. This highly weakened interfacial thermal resistance greatly improved the heat transfer along thermal pathways and resulted in a 26% thermal conductivity enhancement of o-BN@SiC/EP composites, compared with physically contacted oriented h-BN/EP composites, at 15 vol % h-BN. This systematic multiscale simulation broke through the barrier of revealing the heat transfer mechanism of polymer composites from the nanoscale to the macroscale, which provided rational cognition about the effect of the interfacial thermal resistance between fillers on the thermal conductivity of polymer composites.

Published
2023
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21. Simulation-Directed Construction of Bamboo-Forest-Like Heat Conduction Networks to Enhance Silicon Rubber Composites' Heat Conduction Properties.

Author

Ding D, Wang X, Huang R, Wang Z, Jiang G, Yu L, Nie H, Zeng X, Tang B, Qin G, Zhang XA, Zhang Q, Xu J, and Chen Y

Abstract

Highly vertically thermally conductive silicon rubber (SiR) composites are widely used as thermal interface materials (TIMs) for chip cooling. Herein, inspired by water transport and transpiration of Moso bamboo-forests extensively existing in south China, and guided by filler self-assembly simulation, bamboo-forest-like heat conduction networks, with bamboo-stems-like vertically aligned polydopamine-coated carbon fibers (VA-PCFs), and bamboo-leaves-like horizontally layered Al 2 O 3 (HL-Al 2 O 3 ), are rationally designed and constructed. VA-PCF/HL-Al 2 O 3 /SiR composites demonstrated enhanced heat conduction properties, and their through-plane thermal conductivity and thermal diffusivity reached 6.47 W (mK) -1 and 3.98 mm 2  s -1 at 12 vol% PCF and 4 vol% Al 2 O 3 loadings, which are 32% and 38% higher than those of VA-PCF (12 vol%) /SiR composites, respectively. The heat conduction enhancement mechanisms of VA-PCF/HL-Al 2 O 3 networks on their SiR composites are revealed by multiscale simulation: HL-Al 2 O 3 bridges the separate VA-PCF heat flow channels, and transfers more heat to the matrix, thereby increasing the vertical heat flux in composites. Along with high volume resistivity, low compression modulus, and coefficient of thermal expansion, VA-PCF/HL-Al 2 O 3 /SiR composites demonstrate great application potential as TIMs, which is proven using multiphysics simulation. This work not only makes a meaningful attempt at simulation-driven biomimetic material structure design but also provides inspiration for the preparation of TIMs., (© 2024 Wiley‐VCH GmbH.)

Published
2024
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