18 results on '"Tu, K.N."'
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2. Effect of Joule heating on the reliability of microbumps in 3D IC
3. Generalized thermoelastic wave response in a hollow cylinder with temperature-dependent properties based on the memory-dependent derivative of the heat conduction model
4. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
5. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
6. Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars
7. Low temperature interfacial reaction in 3D IC nanoscale materials
8. Distribution of elastic stress as a function of temperature in a 2-μm redistribution line of Cu measured with X-ray nanodiffraction analysis
9. Evolution of interfacial voids in Cu-to-Cu joints
10. Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste
11. Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide
12. A kinetic model of copper-to-copper direct bonding under thermal compression
13. Interfacial void ripening in Cu[sbnd]Cu joints
14. Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility
15. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
16. Fast prediction of electromigration lifetime with modified mean-time-to-failure equation
17. Interfacial void ripening in Cu Cu joints
18. A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu
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