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Mn+1AXn (MAX) phases are novel structural and functional materials with a layered crystal structure. Their unique properties such as good machinability, high electrical conductivity, low friction, and corrosion resistance are appealing for many engineering applications. Herein, Ti2AlC and Ti3AlC2 MAX thin films are synthesized by magnetron sputtering and subsequent thermal annealing. A multilayer approach is used to deposit single‐element nanolayers of titanium, aluminum, and carbon onto silicon substrates with a double‐layer‐diffusion barrier of SiO2 and SixNy. Ti2AlC and Ti3AlC2 thin films (thickness ≈500 nm) are formed via rapid thermal annealing and verified by X‐Ray diffraction. Nanoindentation tests show hardness values of about 11.6 and 5.3 GPa for Ti2AlC and Ti3AlC2, respectively. The tribological behavior of the Ti2AlC and Ti3AlC2 thin films against AISI 52100 steel balls under dry sliding conditions is studied using ball‐on‐flat tribometry. The resulting coefficient of friction (CoF) for Ti2AlC and Ti3AlC2 ranges between 0.21–0.42 and 0.64–0.91, respectively. The better tribological behavior observed for Ti2AlC thin films is ascribed to its smaller grain size, reduced surface roughness, and higher hardness. [ABSTRACT FROM AUTHOR]

The selective metallization of nonconductive polymer materials has broad applications in the fields of integrated circuit technology and metallized patterns. This work discusses a methodology to pattern metal tracks on polybutylene terephthalate substrates. The process consists of three steps: 1) surface patterning with picosecond laser pulses (1030 nm) in air, 2) Pd seeding via treatment in PdCl2 solution, and 3) selective metallization via electroless copper deposition. Picosecond laser irradiation promotes not only surface roughening but also chemical modification to enable Pd seeding as the polymer surface acquires the ability to reduce Pd(II)‐chloride species to metallic Pd. The laser parameters, as well as the PdCl2 concentration and seeding temperature, have an influence on the polymer surface morphology, the concentration and distribution of metallic Pd, and the copper layer properties. Homogeneous copper layers with well‐defined geometries, good coating‐substrate adhesion, and high electrical conductivity can be obtained. This is ascribed to the synergistic effect of the chemical surface activation and roughness development (from 0.13 to ≈1.6 μm). As the patterning and surface activation are performed in air, directly on the as‐received polymer substrate, this methodology shows great potential for metallization of electronic devices with 3D complex geometries. [ABSTRACT FROM AUTHOR]