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The frequency dispersion in admittance measurements in AlGaN/GaN high-electron-mobility transistors, which is typically interpreted to result from an interface trap density Dit, is also known to be caused by effects other than Dit. To study the origin of two peaks of conductance component "Gp/ω" as a function of frequency in lateral gated diodes using AlGaN/GaN structures on Si wafers grown by metal–organic chemical vapor deposition, we measured capacitance C and conductance Gp/ω–voltage V as a function of angular frequency ω (C–ω–V and Gp/ω–ω–V, respectively) of long-gate field-effect transistors with a varied gate length. We also simulated the C–ω–V and Gp/ω–ω–V curves using an equivalent circuit that consisted of actually measured component parameters without Dit. We confirmed that the Gp/ω–ω curves show two peaks caused by the two-dimensional electron gas channel resistance and the gate current leakage and quantitatively determined the two ωpeak positions and intensities. We also discussed the effect of acceptor concentration in the GaN channel-layer on lowering of ωpeak at weak inversion. [ABSTRACT FROM AUTHOR]

GaN films were grown on hydride vapor phase epitaxy (HVPE) AlN/SiC templates by metalorganic CVD (MOCVD) without annealing the reactor to eliminate the memory effect. A step-terrace structure and smooth surface were obtained for the GaN film, which had a thickness of ∼200 nm. Subsequently, AlGaN/GaN heterostructures for application in high electron mobility transistors (HEMTs) with thin GaN channels were fabricated without a C- or Fe-doped GaN buffer layer. The interface quality at the AlGaN/GaN heterostructure was good enough for a two-dimensional electron gas to exhibit Shubnikov–de Haas oscillation in a magnetic field at 1.8 K. The GaN HEMTs with a thin channel on the AlN/SiC templates exhibited both a pinch-off character and conventional properties. In view of both the shorter epitaxial growth time and higher thermal conduction, HVPE AlN/SiC templates are applicable to the fabrication of GaN HEMTs by MOCVD. [ABSTRACT FROM AUTHOR]

We applied scanning internal photoemission microscopy (SIPM) to clarify the electrical characteristics on the electrode periphery of Ni/n-GaN Schottky contacts. Two types of Schottky contacts with different electrode formation methods were prepared. For the samples in which the Ni contacts were evaporated through a metal shadow mask, in the scanning electron microscopes (SEM) observation, the electrode edges were tailed and the tail was divided into two contrasts, a bright region with a width of 15.5 ÎĽ m from the electrode edge followed by a dark region with a width of 32 ÎĽ m. The SIPM signal was obtained from the first 16 ÎĽ m tailing region, and corresponded with the SEM images. For the photolithography sample, a sharp edge less than 1 ÎĽ m wide was obtained and no increase in SIPM signal was detected on the edge. These results indicate SIPM is able to characterize the electrical properties of electrode periphery in conjunction with the structural characteristics. [ABSTRACT FROM AUTHOR]