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Deposition of epitaxial oxide semiconductor films using physical vapor deposition methods requires a detailed understanding of the role of energetic particles to control and optimize the film properties. In the present study, Ga 2 O 3 thin films are heteroepitaxially grown on Al 2 O 3 (0001) substrates using oxygen ion beam sputter deposition. The influence of the following relevant process parameters on the properties of the thin films is investigated: substrate temperature, oxygen background pressure, energy of primary ions, ion beam current, and sputtering geometry. The kinetic energy distributions of ions in the film-forming flux are measured using an energy-selective mass spectrometer, and the resulting films are characterized regarding crystalline structure, microstructure, surface roughness, mass density, and growth rate. The energetic impact of film-forming particles on the thin film structure is analyzed, and a noticeable decrease in crystalline quality is observed above the average energy of film-forming Ga + ions around 40 eV for the films grown at a substrate temperature of 725 ° C.

Deposition of epitaxial oxide semiconductor films using physical vapor deposition methods requires a detailed understanding of the role of energetic particles to control and optimize the film properties. In the present study, Ga 2 O 3 thin films are heteroepitaxially grown on Al 2 O 3 (0001) substrates using oxygen ion beam sputter deposition. The influence of the following relevant process parameters on the properties of the thin films is investigated: substrate temperature, oxygen background pressure, energy of primary ions, ion beam current, and sputtering geometry. The kinetic energy distributions of ions in the film-forming flux are measured using an energy-selective mass spectrometer, and the resulting films are characterized regarding crystalline structure, microstructure, surface roughness, mass density, and growth rate. The energetic impact of film-forming particles on the thin film structure is analyzed, and a noticeable decrease in crystalline quality is observed above the average energy of film-forming Ga + ions around 40 eV for the films grown at a substrate temperature of 725 ° C. [ABSTRACT FROM AUTHOR]

Gallium oxide thin films were grown by ion beam sputter deposition (IBSD) at room temperature on Si substrates with systematically varied process parameters: primary ion energy, primary ion species (O 2 + and Ar +), sputtering geometry (ion incidence angle α and polar emission angle β), and O 2 background pressure. No substrate heating was applied because the goal of these experiments was to investigate the impact of the energetic film-forming species on thin film properties. The films were characterized with regard to film thickness, growth rate, crystallinity, surface roughness, mass density, elemental composition and its depth profiles, and optical properties. All films were found to be amorphous with a surface roughness of less than 1 nm. The stoichiometry of the films improved with an increase in the energy of film-forming species. The mass density and the optical properties, including the index of refraction, are correlated and show a dependency on the kinetic energy of the film-forming species. The ranges of IBSD parameters, which are most promising for further improvement of the film quality, are discussed.