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Bi 2 Te 3 is a successful and commercial thermoelectric material. However, Bi 2 Te 3 is easily generates point defects, which limits its thermoelectric (TE) properties. This study presents a novel method to tune point defects by using short-range atomic diffusion via pulsed electric field (PEF) treatment in C-doped Bi 2 Te 3 films. The C atoms migrate from the interstitial position in the Bi layer (C i) and the Van der Waals gap (C vdw) to the Bi vacancy after the PEF treatment. For this case, it increases the content of the Te–C bonds for the PEF films, resulting in increased electron concentration. And the PEF can eliminate amorphous regions of the C-doped Bi 2 Te 3 films. In addition, the shorter bond length of the Te–C improves the compressive stress of the film and increases the effective mass of carriers. Thus, the conductivity and the Seebeck coefficient are improved simultaneously. In this study, the power factor was 2450.32 μW m−1·K−2 at 513 K after the PEF treatment. Therefore, the PEF is an effective method to improve TE properties by short-range atomic diffusion. [ABSTRACT FROM AUTHOR]

• Angle of grain boundaries converts to low from high by electrostatic force. • Low energy of low-angle grain boundary scatters carrier but not phonon. • Pulse current treatment provides a method to get high power factor and power density. Current applications of thermoelectric (TE) materials are limited by their low conversion efficiency. Interfacial engineering is a common way to improve TE properties. This study employed a pulsed electric field to tune the grain interfacial structure of Bi 2 Te 3 films and thereby improve their power factor. The high-angle grain boundaries of the as-deposited films were transformed into low-angle grain boundaries (LAGBs) by the electrostatic force of a high pulse current density. The low interfacial energy of LAGBs maintains high carrier mobility while their reduced defects result in a low carrier concentration. These effects improve the Seebeck coefficient and conductivity simultaneously, with the power factor reaching 5394.77 μW·m−1·K−2 at 513 K. In addition, the compression stress generated by LAGBs enhances phonon scattering, creating a film with the highest power density yet reported (1.31 W·m−2). This provides a method for using PEF to improve the performance of TE materials. [ABSTRACT FROM AUTHOR]