6 results on '"Huang, J. H."'
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2. Enhanced Reactivity of Electroless Cu Interconnection by Surface Oxidation Pretreatment
3. Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation
4. A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging
5. Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
6. Ultrasound Localization of Nitinol Wire of Sub-Wavelength Dimension.
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