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• Multi-component CFA can significantly improve the stability of foam. • High alkaline environment has a negative effect on foam stability. • AAS are suitable to prepare foamed concrete with high foam content. • AAS foamed concrete has better pore distribution than OPC foamed concrete. The multi-component composite foaming agent (CFA) with excellent properties was prepared by sodium α-alkenyl sulfonate (AOS), sodium dodecyl sulfate (K12), coconut oil (CO), and rosin liquid (RL), and three foam stabilizers, namely hydroxypropyl methylcellulose ether (HPMC), xanthan gum and sucrose. The foam stability and the foam stability in an alkaline environment and slurry were studied. The results show that the optimal composition of the multi-component CFA is 0.4% AOS, 0.1 % K12, 0.2% RL, 0.3% CO, 0.08% HPMC, 0.6% xanthan gum and 0.6% sucrose. When the CFA is used to prepare foam, the foaming multiple (FM) is 41, and the 1-hour settlement distance (SD) and the 1-hour bleeding ratio (BR) are zero. Moreover, the foam can maintain excellent stability within 2 h. Under an alkaline environment, when the pH is higher than 12.4, the foam stability will be adversely affected. The effective foam ratio (EFR) of foamed concrete increases first and then decreases with the increase of foam content. When foam content is less than 2.8 L/kg, the foam stability in ordinary Portland cement (OPC) paste is better than that of alkali-activated slag (AAS) paste. When the foam content is higher than 2.8 L/kg, the foam stability of the latter is better than the former. When foam content is 2.8 L/kg, the apparent density OPC and AAS system is 698 kg/m3 and 623 kg/m3, respectively. Compared with OPC foamed concrete, AAS foamed concrete presents more small pores, smaller average pore size and better roundness. [ABSTRACT FROM AUTHOR]

Alkali-Activated Slag Cement (AASC) activated by weak alkaline components has good workability and safety. Sodium carbonate (Na 2 CO 3 , SC), sodium sulfate (Na 2 SO 4 , SS), reactive magnesium oxide (R-MgO), and calcium hydroxide (Ca(OH) 2 , CH) were used to prepare the AASC. The hydration process, phase composition and hydration kinetics of AASC were studied. The results showed that the pH value of AASC slurry activated by weak alkaline components ranging from 10.8 to 13.2. CH could significantly affect the pH of AASC slurry. When the dosage reached more than 5%, the pH value of AASC slurry reached more than 12.0. The hydration heat release of AASC activated by weak alkaline components was mainly concentrated in 1 day. Two hydration heat release peaks appeared. The initial hydration peak appeared within 0.5 h-1 h, and the acceleration hydration peak appeared within 1 h-8 h. When the content of CH was 5%, and the content of SS and SC was 7% and 4%, the acceleration peak of AASC was much higher than that of others. At the same time, the Krstulovic-Dabic model was used to study the hydration kinetics of AASC. The increase of SS content prolonged the NG-I and I-D processes. CH accelerated the hydration rate of AASC and shortened the hydration process of AASC. The main hydration products of AASC activated by weakly alkaline components were C-(A)-S-H gel, calcite, ettringite, hydrotalcite and gaylussite. R-MgO was favorable for the formation of hydrotalcite, while SS was favorable for the formation of ettringite. • Weakly alkaline salt can make Alkali-Activated Slag Cement (AASC) have a good alkaline environment. • The nucleation and crystal growth (NG)- phase boundary reaction (I) - diffusion (D) process of AASC is affected by weak alkaline salt. • There are more crystals in hydration products. [ABSTRACT FROM AUTHOR]

With the increase in the power density of power semiconductor chips, the lateral temperature gradient over the chip surface becomes more pronounced. Temperature gradients play an important role in reliability evaluation of IGBTs and have attracted great attentions. In this paper, the influence of IGBT chip temperature gradients on the crack initiation site and propagation path of the solder layer is investigated by finite-element analysis (FEA). Results indicated that the temperature gradient could influence the mechanism of solder layer fatigue. With the temperature gradient increasing, the crack initiation site shifts from the edge of solder layer to the center. The crack propagation path also changed. The fatigue mechanism of the solder layer under high temperature gradients is investigated by FEA. The inelastic strain energy density per cycle (ΔW) is found to be unequal at crack initiation and crack propagation stages. Accordingly, a novel energy-based lifetime prediction model based on Darveaux's model for solder layer fatigue of IGBTs is proposed, which takes into account the variation of ΔW within these two stages and can better characterize the processes of crack initiation and propagation in the solder layer. Subsequently, two lifetimes of IGBT modules under accelerated aging tests from the existing publications are used to verify the effectiveness of the proposed model. Finally, the accelerated aging tests were carried out to support the theoretical analysis on the direction of crack propagation under high temperature gradients. • The influence of temperature gradient on crack initiation site and propagation path is investigated by FEA • The fatigue mechanism under high temperature gradients is investigated by adding solder layer cracks with different lengths • An energy-based lifetime prediction model for solder layers of IGBT modules under high temperature gradients is proposed • ΔW is inequality in crack initiation and propagation stage [ABSTRACT FROM AUTHOR]

Reliability of bond wires in power modules has been a main subject of interest in both industry and academia. Until now, analytical modeling of thermo-mechanical stress mainly focuses on the loop height variation of bond wires instead of plastic strain, which is the key factor causing the fatigue failure. In this paper, an analytical model for analyzing plastic strain of bond wires in IGBT modules is proposed. Using a laser displacement sensor, the dynamic loop height variations of bond wires under different heating currents are experimentally measured, based on which the finite element analysis (FEA) simulation is calibrated and verified to reveal the actual thermo-mechanical stress. In this way, the usefulness of our proposed method is verified by comparing its simulation results with those from the multi-physics fields FEA method. Finally, the relationship between the bonding angle and the plastic strain at the heel of bond wires is established. This study would provide new perspectives into further research on thermo-mechanical fatigue analysis and optimal design of bond wires in power modules. • An analytical model for analyzing plastic strain of bond wires in IGBT modules is proposed. • The FEA simulation is calibrated based on the experimental results of loop top displacement. • The relationship between the bonding angle and the plastic strain at the heel of bond wires is established. • The models have been compared with FEA simulation results with good agreements. [ABSTRACT FROM AUTHOR]

Physical lifetime prediction methods based on inelastic strain energy density (energy-based lifetime prediction) have been proven to be effective in producing reliable results on small solder joints (ball-grid arrays or chip-scale package) due to their capabilities to represent physical characteristics of soldering materials and loading history. However, in the existing energy-based lifetime models for solder layer failure the inelastic strain energy density is usually assumed to unchanged during aging, which is untrue particularly for large-area solder joints when crack propagation is considered. In this paper, an energy-based lifetime prediction method is proposed for failure of IGBT modules by explicit emulation of solder layer degradation. Inelastic strain energy density variances with respect to aging are meticulously modeled. The large-area solder layer is evenly divided into meshed elements, birth and death technique in finite element analysis (FEA) is used to successively emulate crack propagation. In this way, the increment of thermal resistance due to the solder layer degradation can be predicted. The lifetime prediction results by our proposed method show nice agreement with the experiment under different aging conditions. • An energy-based lifetime prediction method is proposed for failure of IGBT modules • Birth and death technique in FEA is used to successively emulate crack propagation • The increment of thermal resistance due to the solder layer degradation can be predicted • ΔW will change with different aging stage [ABSTRACT FROM AUTHOR]