10 results on '"Sleeckx, E."'
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2. THE CONSENS PROJECT: A METHODOLOGY AND INTEGRATION PLATFORM TO OPTIMISE TIME, QUALITY AND COST IN THE CONCURRENT PRODUCT DEVELOPMENT PROCESS
3. Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
4. Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology
5. Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding
6. Characterization of inorganic dielectric layers for low thermal budget wafer-to-wafer bonding
7. Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
8. 3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly
9. Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside
10. Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
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