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We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of

Side leakage experiments have been performed on the organic interlayer, so-called organic coating for planarization (OCP), in a hybrid thin-film encapsulation (TFE) stack based on two silicon nitride (SiN) barrier layers that was developed for organic light-emitting diodes (OLED). To measure the side leakage into OCP, a metallic Ca thin-film monitor can be used. However, the water uptake capacity of the Ca monitor affects the measurements. Here, we eliminated the contribution of the Ca layer from the measurement by variation of the Ca thickness and by measuring the side leakage until it reaches the Ca layer. For OCP with a water getter inside (5% CaO) the side leakage can be monitored by the loss of scattering of the CaO when it reacts with water to Ca(OH)2. This work describes measurements of the rate of side leakage into the OCP layer of the TFE stack, both for plain OCP and for OCP with CaO getter inside. The side leakage curves are used to derive diffusion coefficients. Performing measurements at various climates provides acceleration factors that are relevant for the performance quantification of the TFE stack. The limiting factors on the performance of an unstructured TFE stack as produced in a roll-to-roll (R2R) process are presented. For small OLED devices side leakage would drastically reduce the shelf lifetime but for larger devices the permeation properties of the TFE stack determine the shelf lifetime.

A technique is presented on tracing the sub-micron pinholes that result in black spots in organic light-emitting diodes (OLED) when exposed to ambient atmosphere. The mystery about the type and nature of tiny pinholes present in the OLED cathode that allow oxygen and/or moisture ingress in minute quantities causing black spot formation, is clarified. The technique can accurately locate nanodefects or pinholes in the center of black spots of various sizes, even on a centimeter scale. Pinholes in the investigated OLEDs were shown to be caused by different particles originating from various locations in the device stack. Defects in the Ba-Al cathode of a solution processed polymer LED (PLED) and pinholes in the LiF-Al cathode of a thermally evaporated small molecule organic LED (smOLED) were investigated and compared. The technique is a powerful tool for inspection and can, thereby, accelerate the process optimization for OLED fabrication.

The requirement for evaluating high performance barrier layers with water vapor transmission rates (WVTR) far below 10−3 g/m2 d has been sparked by the growing application of flexible and organic electronics. While several highly sensitive WVTR-measurement techniques are described in the literature, their accuracy and comparability has not yet been tested. There is an absence of direct comparison of these methods. With a growing body of literature referring to different coating and barrier technologies (often under different testing conditions), it is extremely difficult to gather a coherent picture both of the performance of the materials studied and the permeation measurement methods used. In order to clarify these points we report on independent WVTR measurements of the same batch of a high performance barrier film under two sets of conditions in several laboratories with different state-of the-art methods. These methods also include several calcium test set-ups. The results showed that, while some differences are present, there is a remarkable level of agreement between the measurement methods even prior to harmonization.

To protect organic flexible devices from the ambient, they have to be encapsulated. Depending on the application in mind (OLED lighting, PV) different thin-film encapsulation methodology can be chosen. Each encapsulation process has different requirements and fabrication process freedom might be restricted, for example by mechanical reliability requirements or the total cost of the end product. Here we will show our recent investigations into different thin-film barriers with respect to their application and the route to production.

Gas diffusion barriers (GDB) are essential building blocks for the protection of sensitive materials or devices against ambient gases, like oxygen and moisture. In this work, we study the mechanics of GDBs processed by atomic layer deposition (ALD). We demonstrate that a wide range of ALD grown barrier layers carry intrinsic mechanical tensile stress in the range of 400-500 MPa. In the application of these GDBs on top of organic electronic devices, we derive a critical membrane force (σ · h)crit = 1200 GPaÅ (corresponding to a layer thickness of about 300 nm) for the onset of cracking and delamination. At the same time, we evidence that thicker GDBs would be more favorable for the efficient encapsulation of statistically occurring particle defects. Thus, to reduce the overall membrane force in this case to levels below (σ · h)crit, we introduce additional compressively strained layers, e.g., metals or SiNx. Thereby, highly robust GDBs are prepared on top of organic light emitting diodes, which do not crack/delaminate even under damp heat conditions 85 °C/85% rh.

Promising results in terms of moisture and oxygen permeation barrier properties have been reported for organic/inorganic multilayers, but the impact of the organic interlayer on the overall barrier performance is still under discussion. It is generally accepted that the organic interlayer acts as a smoothening layer, allowing for the decoupling between defects/pinholes present in the polymer substrate and the inorganic layer. It is, however, also hypothesized that the organic interlayer infiltrates into the nano-pores present in the inorganic barrier layer, therefore affecting the barrier properties at microstructural level. In the present work, the moisture permeation barrier performance of SiO2/organosilicon multilayers deposited by means of initiated- and plasma enhanced-chemical vapor deposition is investigated. Calcium test measurements were used to discriminate between the overall water permeation (effective water vapor transmission rate, WVTR) through the layer and the permeation through the matrix porosity (intrinsic WVTR). The improvement in terms of intrinsic barrier performance was found to correlate with the residual nano-porosity content, due to the filling/infiltration of the organosilicon monomer in the SiO2 nano-pores. However, such improvement upon the deposition of the organosilicon interlayer is limited to a factor four. These results, in combination with the analysis of the local defects present in the multilayer structure, lead to the conclusion that the main contribution of the organosilicon interlayer to the overall barrier performance is the decoupling of the above-mentioned local defects/pinholes.