10 results on '"Kang, Hanbyul"'
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2. In-situ Electrothermal TEM Investigation of Electromigration in fully Embedded Cu/Co Interconnects
3. PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices
4. Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy
5. Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)
6. Characterization of plate-like Ni-Sn intermetallic compounds in Sn-Ag solder bump
7. Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint
8. Formation of octahedral corrosion products in Sn–Ag flip chip solder bump
9. Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation
10. Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism
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