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Manipulation of the heterointerfacial structure and/or chemistry of transition metal oxides is of great interest for the development of novel properties. However, few studies have focused on heterointerfacial effects on the growth characteristics of oxide thin films, although such interfacial engineering is crucial to determine the growth dynamics and physical properties of oxide heterostructures. Herein, we show that heterointerfacial effects play key roles in determining the growth process of oxide thin films by overcoming the simple epitaxial strain energy. Brownmillerite (SrFeO2.5; BM-SFO) thin films are epitaxially grown along the b-axis on both SrTiO3(001) and SrRuO3/SrTiO3(001) substrates, whereas growth along the a-axis is expected from conventional epitaxial strain effects originating from lattice mismatch with the substrates. Scanning transmission electron microscopy measurements and first principles calculations reveal that these peculiar growth characteristics of BM-SFO thin films originate from the heterointerfacial effects governed by their distinct interfacial structures. These include octahedral connectivity between dissimilar oxides containing different chemical species and a peculiar transition layer for BM-SFO/SrRuO3/SrTiO3(001) and BM-SFO/SrTiO3(001) heterostructures, respectively. These effects enable subtle control of the growth process of oxide thin films and could facilitate the fabrication of novel functional devices.

We had discovered novel resistance switching phenomena in SrCoOx epitaxial thin films. We have interpreted the results in terms of the topotactic phase transformation between their insulating brownmillerite phase and the conducting perovskite phase and the existence of a rather vertical conducting filament due to its inherent layered structure. However, the rough interface observed between the SrCoOx and the Au top electrode (area ~10000 μm2) was assumed to result in the observed fluctuation in key switching parameters. In order to verify the effect of rough interface on the switching performance in the SrCoOx device, in this work, we studied the resistive switching properties of a SrCoOx device by placing a Au-coated tip (end area ~0.5 μm2) directly on the film surface as the top electrode. The resulting device displayed much improved endurance and showed high uniformity in key switching parameters as compared to the device having a large top electrode area. A simulation result confirmed that the Au-coated tip provides a local confinement of the electrical field, resulting in confinement of oxygen ion distribution and therefore localization of the conducting filament. By minimizing other free and uncontrollable parameters, the designed experiment here provides the most direct and isolated evidence that the rough interface between electrode and ReRAM matrix is detrimental for the reproducibility of resistivity switching phenomena.

We report monolithic integration of indium arsenide (InAs) nanorods and zinc oxide (ZnO) nanotubes using a multilayer graphene film as a suspended substrate, and the fabrication of dual-wavelength photodetectors with the hybrid configuration of these materials. For the hybrid nanostructures, ZnO nanotubes and InAs nanorods were grown vertically on the top and bottom surfaces of the graphene films by metal-organic vapor-phase epitaxy and molecular beam epitaxy, respectively. The structural, optical, and electrical characteristics of the hybrid nanostructures were investigated using transmission electron microscopy, spectral photoresponse analysis, and current–voltage measurements. Furthermore, the hybrid nanostructures were used to fabricate dual-wavelength photodetectors sensitive to both ultraviolet and mid-infrared wavelengths. Wide- and narrow-bandgap semiconductor nanostructures were monolithically integrated on graphene layers by direct heteroepitaxial growth. The structural, optical, and electrical characteristics of the hybrid nanostructures were investigated. Furthermore, dual-wavelength photodetectors sensitive to both ultraviolet and mid-infrared wavelengths were fabricated using the hybrid nanostructures.

Van der Waals heterostructures composed of topologically nontrivial materials are attractive platforms to explore a wide variety of unique materials properties and emergent quantum phenomena. The authors demonstrate molecular beam epitaxial growth of Bi${}_{2}$Se${}_{3}$ thin films on $\ensuremath{\alpha}$-RuCl${}_{3}$ single crystal layers as a prototypical van der Waals heterostructure of a topological insulator and a quantum spin liquid. Their microstructural analysis shows the formation of commensurate supercells with a well-defined moire periodicity, enabled by van der Waals heteroepitaxy. They also investigate electrical transport properties of the heterostructure with temperature-dependent Hall measurements.

We report on heteroepitaxial growth of Sb2Te3–Bi2Te3 lateral heterostructures using molecular beam epitaxy. The lateral heterostructures were fabricated by growing Bi2Te3 islands of hexagonal or triangular nanostructures with a typical size of several 100 nm and thickness of ∼15 nm on graphene substrates and Sb2Te3 laterally on the side facets of the nanostructures. Multiple-step processes with different growth temperatures were employed to grow the lateral heterostructures. Electron microscopy techniques indicate that the inner region is Bi2Te3 and the outer Sb2Te3 was formed laterally on the graphene in an epitaxial manner. The interface between Bi2Te3 and Sb2Te3 from planar and cross-sectional views was studied by the aberration-corrected (C s-corrected) high-angle annular dark-field scanning transmission electron microscope technique. The cross-sectional electron microscopy investigation shows no wetting layer of Sb2Te3 on Bi2Te3, corroborating perfect lateral heterostructure formation. In addition, we investigated the topological properties of Sb2Te3–Bi2Te3 lateral heterostructures using first-principles calculations.

The electrochemical reduction of carbon dioxide (CO2 ) to value-added products is a promising approach to reducing excess CO2 in the atmosphere. However, the development of electrocatalysts for highly selective and efficient electrochemical CO2 reduction has been challenging because protons are usually easier to reduce than CO2 in an aqueous electrolyte. Recently, single-atom catalysts (SACs) have been suggested as candidate CO2 reduction catalysts due to their unique catalytic properties. To prepare single-atom metal active sites, the stabilization of metal atoms over conductive supports such as graphene sheets to prevent metal aggregation is crucial. To address this issue, a facile method was developed to prepare single-atom nickel active sites on reduced graphene oxide (RGO) sheets for the selective production of carbon monoxide (CO) from CO2 . The tris(2-benzimidazolylmethyl)amine (NTB) ligand was introduced as a linker that can homogeneously disperse nickel atoms on the graphene oxide (GO) sheets. Because the NTB ligands form strong interactions with the GO sheets by π-π interactions and with nickel ions by ligation, they can effectively stabilize nickel ions on GO sheets by forming Ni(NTB)-GO complexes. High-temperature annealing of Ni(NTB)-GO under inert atmosphere produces nickel- and nitrogen-doped reduced graphene oxide sheets (Ni-N-RGO) with single-atom Ni-N4 active sites. Ni-N-RGO shows high CO2 reduction selectivity in the reduction of CO2 to CO with 97 % faradaic efficiency at -0.8 V vs. RHE (reversible hydrogen electrode).

We report on the fabrication and characteristics of an individually addressable gallium nitride (GaN) microdisk light-emitting diode (LED) array in free-standing and ultrathin form. A high-quality GaN microdisk array with n-GaN, InGaN/GaN quantum wells and p-GaN layers was epitaxially grown on graphene microdots patterned on SiO2/Si substrates. Due to the weak attachment of the graphene microdots to the growth substrate, a microdisk array coated with a polyimide layer was easily separated from the substrate using mechanical or chemical methods to form an ultrathin free-standing film. Individually addressable microdisk LEDs were created by forming thin metal contacts on the p-GaN and n-GaN surfaces in a crossbar configuration. Each microdisk LED that comprised an ultrahigh resolution array of 2500 pixels per inch was found to be uniquely addressable. The devices in free-standing form exhibited stable electrical and optoelectronic characteristics under extreme bending conditions and continuous operation mode despite the absence of a heat dissipating substrate. These results present promising approaches for the fabrication of high-quality inorganic semiconductor devices for ultrahigh resolution and high-performance flexible applications. A free-standing, ultrathin and flexible film of micrometer-scale semiconductor light sources has been created by scientists in South Korea. Light-emitting diodes are rapidly replacing less efficient alternatives in both lighting and displays but the traditional inorganic semiconductor materials they are made of are rigid, which means it is difficult to adapt them to applications requiring curved or flexible devices. Gyu-Chul Yi from the Seoul National University and co-workers developed uniquely addressable gallium nitride microdisk light-emitting diode arrays embedded in free-standing and ultrathin polyimide layers. Gallium nitride microdisk arrays they grew on graphene microdots were easily released from the substrate due to the weak bond between the graphene and the underlying substrate. This approach could be used to create ultraflexible and high-resolution light-sources for wearable, medical or implantable device applications. We report on the fabrication and characteristics of an individually addressable GaN microdisk LED array in free-standing and ultrathin form. GaN microdisk array was grown on graphene microdots, and the microstructures coated with a polyimide layer were easily separated from the substrate to form an ultrathin free-standing film. Crossbar configuration of metal leads enabled each microdisk LED in an array to be uniquely addressable. The devices in free-standing form exhibited stable electrical and optoelectronic characteristics under extreme bending conditions and continuous operation mode despite the absence of a heat dissipating substrate.

Manipulation of the heterointerfacial structure and/or chemistry of transition metal oxides is of great interest for the development of novel properties. However, few studies have focused on heterointerfacial effects on the growth characteristics of oxide thin films, although such interfacial engineering is crucial to determine the growth dynamics and physical properties of oxide heterostructures. Herein, we show that heterointerfacial effects play key roles in determining the growth process of oxide thin films by overcoming the simple epitaxial strain energy. Brownmillerite (SrFeO2.5; BM-SFO) thin films are epitaxially grown along the b-axis on both SrTiO3(001) and SrRuO3/SrTiO3(001) substrates, whereas growth along the a-axis is expected from conventional epitaxial strain effects originating from lattice mismatch with the substrates. Scanning transmission electron microscopy measurements and first principles calculations reveal that these peculiar growth characteristics of BM-SFO thin films originate from the heterointerfacial effects governed by their distinct interfacial structures. These include octahedral connectivity between dissimilar oxides containing different chemical species and a peculiar transition layer for BM-SFO/SrRuO3/SrTiO3(001) and BM-SFO/SrTiO3(001) heterostructures, respectively. These effects enable subtle control of the growth process of oxide thin films and could facilitate the fabrication of novel functional devices.

Amorphous oxide semiconductor (AOS)-based Schottky diodes have been utilized for selectors in crossbar array memories to improve cell-to-cell uniformity with a low-temperature process. However, thermal instability at interfaces between the AOSs and metal electrodes can be a critical issue for the implementation of reliable Schottky diodes. Under post-fabrication annealing, an excessive redox reaction at the ohmic interface can affect the bulk region of the AOSs, inducing an electrical breakdown of the device. Additionally, structural relaxation (SR) of the AOSs can increase the doping concentration at the Schottky interface, which results in a degradation of the rectifying performance. Here, we improved the thermal stability at AOS/metal interfaces by regulating the oxygen vacancy (VO) concentration at both sides of the contact. For a stable quasi-ohmic contact, a Cu-Mn alloy was introduced instead of a single component reactive metal. As Mn only takes up O in amorphous In-Ga-Zn-O (a-IGZO), excessive VO generation in bulk region of a-IGZO can be prevented. At the Schottky interfaces, the barrier characteristics were not degraded by thermal annealing as the Ga concentration in a-IGZO increased. Ga not only reduces the inherent VO concentration but also retards SR, thereby suppressing tunneling conduction and enhancing the thermal stability of devices.

Three central themes in the study of the phenomenon of resistive switching are the nature of the conducting phase, why it forms, and how it forms. In this study, the answers to all three questions are provided by performing switching experiments in situ in a transmission electron microscope on thin films of the model system polycrystalline SrTiO

Electroplastic phenomenon has been demonstrated by that the elongation increases remarkably during deformation under electric current without a significant elevation of temperature due to Joule heating. Since the 1960s, the electroplasticity has been actively investigated; however, an exact explanation of the mechanism has been lacking. In this study, the origin of electroplasticity in metallic materials is elucidated based on first principle calculation, finite element simulation and experimental approaches. First principle calculations on a system that includes a grain boundary, which is the general defect in polycrystalline metallic materials, show that a charge imbalance near defects weakens drastically atomic bonding under electric current. The electroplastic behavior could be well reproduced with a small-scale, microstructure-based finite element simulation, which incorporates an effective temperature near defects under electric current. The effective temperature under electric current reflects the weakening of atomic bonding due to charge imbalance. In addition, the weakening of atomic bonding was confirmed by measuring the elastic modulus under electric current, which is inherently related to the atomic bonding strength. It can be said that the mechanical properties under electric current ultimately depend on the existing defects in metallic materials.

A Cu alloy with high strength and conductivity, which are trade off characteristics, was developed using discontinuous precipitates as the hardening agent. The scanning electron microscopy and transmission electron microscopy results showed that a considerable internal strain and geometrically necessary dislocations were generated in the alloy because of discontinuous precipitation. Furthermore, nanotwins, which are rarely observed in cold-drawn Cu–Ni–Si alloys, were observed in the alloy. Since nanotwins show little effect on the electrical resistivity of Cu alloys while effectively interfering with the dislocation movement, they are one of the key factors endowing Cu alloys with the trade-off characteristics of high strength and conductivity.

A novel characterization technique using both in situ reflection high-energy electron diffraction (RHEED) transmission mode and transmission electron microscopy (TEM) has been developed to investigate the growth behaviour of semiconductor nanostructures. RHEED employed in transmission mode enables the acquisition of structural information during the growth of nanostructures such as nanorods. Such real-time observation allows the investigation of growth mechanisms of various nanomaterials that is not possible with conventional ex situ analytical methods. Additionally, real-time monitoring by RHEED transmission mode offers a complete range of information when coupled with TEM, providing structural and chemical information with excellent spatial resolution, leading to a better understanding of the growth behaviour of nanomaterials. Here, as a representative study using the combined technique, the nucleation and crystallization of InAs nanorods and the epitaxial growth of InxGa1−xAs(GaAs) shell layers on InAs nanorods are explored. The structural changes in the InAs nanorods at the early growth stage caused by the transition of the local growth conditions and the strain relaxation processes that occur during epitaxial coating of the shell layers are shown. This technique advances our understanding of the growth behaviour of various nanomaterials, which allows the realization of nanostructures with novel properties and their application in future electronics and optoelectronics.

An oxide-based resistance memory is a leading candidate to replace Si-based flash memory as it meets the emerging specifications for future memory devices. The non-uniformity in the key switching parameters and low endurance in conventional resistance memory devices are preventing its practical application. Here, a novel strategy to overcome the aforementioned challenges has been unveiled by tuning the growth direction of epitaxial brownmillerite SrFeO2.5 thin films along the SrTiO3 [111] direction so that the oxygen vacancy channels can connect both the top and bottom electrodes rather directly. The controlled oxygen vacancy channels help reduce the randomness of the conducting filament (CF). The resulting device displayed high endurance over 106 cycles, and a short switching time of ∼10 ns. In addition, the device showed very high uniformity in the key switching parameters for device-to-device and within a device. This work demonstrates a feasible example for improving the nanoscale device performance by controlling the atomic structure of a functional oxide layer.

We report the growth of InAs and ZnO nanorods vertically on each surface of graphene layers and our investigation of the electrical characteristics.

Three central themes in the study of the phenomenon of resistive switching are the nature of the conducting phase, why it forms, and how it forms. In this study, the answers to all three questions are provided by performing switching experiments in situ in a transmission electron microscope on thin films of the model system polycrystalline SrTiO3 . On the basis of high-resolution transmission electron microscopy, electron-energy-loss spectroscopy and in situ current-voltage measurements, the conducting phase is identified to be SrTi11 O20 . This phase is only observed at specific grain boundaries, and a Ruddlesden-Popper phase, Sr3 Ti2 O7 , is typically observed adjacent to the conducting phase. These results allow not only the proposal that filament formation in this system has a thermodynamic origin-it is driven by electrochemical polarization and the local oxygen activity in the film decreasing below a critical value-but also the deduction of a phase diagram for strongly reduced SrTiO3 . Furthermore, why many conducting filaments are nucleated at one electrode but only one filament wins the race to the opposite electrode is also explained. The work thus provides detailed insights into the origin and mechanisms of filament generation and rupture.

Resistive switching memory, which is mostly based on polycrystalline thin films, suffers from wide distributions in switching parameters-including set voltage, reset voltage, and resistance-in their low- and high-resistance states. One of the most commonly used methods to overcome this limitation is to introduce inhomogeneity. By contrast, in this paper, we obtained uniform resistive switching parameters and sufficiently low forming voltage by maximizing the uniformity of an epitaxial thin film. To achieve this result, we deposited an SrFeOx/SrRuO3 heteroepitaxial structure onto an SrTiO3 (001) substrate by pulsed laser deposition, and then we deposited an Au top electrode by electron-beam evaporation. This device exhibited excellent bipolar resistance switching characteristics, including a high on/off ratio, narrow distribution of key switching parameters, and long data retention time. We interpret these phenomena in terms of a local, reversible phase transformation in the SrFeOx film between brownmillerite and perovskite structures. Using the brownmillerite structure and atomically uniform thickness of the heteroepitaxial SrFeOx thin film, we overcame two major hurdles in the development of resistive random-access memory devices: high forming voltage and broad distributions of switching parameters.

We report the fabrication and characteristics of vertical microtube light-emitting diode (LED) arrays with a metal core inside the devices. To make the LEDs, gallium nitride (GaN)/indium gallium nitride (In(x)Ga(1-x)N)/zinc oxide (ZnO) coaxial microtube LED arrays were grown on an n-GaN/c-aluminum oxide (Al2O3) substrate. The microtube LED arrays were then lifted-off the substrate by wet chemical etching of the sacrificial ZnO microtubes and the silicon dioxide (SiO2) layer. The chemically lifted-off LED layer was then transferred upside-down on other supporting substrates. To create the metal cores, titanium/gold and indium tin oxide were deposited on the inner shells of the microtubes, forming n-type electrodes inside the metal-cored LEDs. The characteristics of the resulting devices were determined by measuring electroluminescence and current-voltage characteristic curves. To gain insights into the current-spreading characteristics of the devices and understand how to make them more efficient, we modeled them computationally.

We report the selective-area heteroepitaxial growth of hexagonal boron nitride (h-BN) on graphene layers using catalyst-free chemical vapor deposition. For both catalyst-free and selective-area growth, exfoliated graphene layers were irradiated with a focused ion beam to generate nucleation sites on the inert graphene surface. A high-quality, ultrathin h-BN micropattern array was selectively grown only on the patterned region of graphene using borazine, ammonia, and nitrogen without any metal catalyst. The crystal structure and microstructural properties of h-BN grown on graphene were investigated using synchrotron radiation x-ray diffraction and transmission electron microscopy, respectively. The catalyst-free growth mechanism and heteroepitaxial relationship between h-BN and graphene layers are discussed.

Single-crystal gallium nitride (GaN) layers were directly grown on centimeter-scale hexagonal boron nitride (h-BN). Using chemical vapor deposition (CVD), centimeter-scale h-BN films were synthesized on a single-crystal Ni(111) and readily transferred onto amorphous fused silica supporting substrates that had no epitaxial relationship with GaN. For growing fully coalescent GaN layers on h-BN, the achievement of high-density crystal growths was a critical growth step because the sp2-bonded h-BN layers are known to be free of dangling bonds. Unlike GaN layers grown on a typical heterogeneous sapphire substrate, the morphological and microstructural results strongly suggest a high-density growth feature that is driven by the atomic cliffs inherent in the CVD-grown h-BN layers. More importantly, the GaN layers grown on CVD-grown h-BN exhibited a flat and continuous surface morphology with well-aligned crystal orientations both along the c-axis and in-plane, indicating the characteristics of GaN heteroepitaxy on h-BN. A method for depositing high-quality semiconductor thin films on a two-dimensional material has been developed by researchers in Korea. Growing one defect-free material on another is difficult because of their different atomic structures, particularly when very thin samples are required. Now, Gyu-Chul Yi and co-workers from Seoul National University in Korea have grown large areas of single crystals of the semiconductor gallium nitride directly on boron nitride, which is useful for flexible electronics. They used chemical vapor deposition, which works by exposing a hot volatile gas incorporating atoms of the top material to a cooler substrate. The gallium nitride films could be readily transferred to silica substrates. Since the technique can produce large areas of the material it is a promising for making flexible devices on a commercial scale. Here, we utilize large-size scalable single-crystal 2D films to grow single crystalline inorganic semiconductors. Centimeter-scale hexagonal boron nitride (h-BN) films were synthesized on a single-crystal Ni(111) using chemical vapor deposition (CVD). Single-crystal GaN layers were directly grown on h-BN using metal–organic vapor phase epitaxy. The CVD-grown h-BN exhibited many atomic cliffs that enabled us to grow high-density GaN islands to be merged as homogeneous and flat GaN films. We also investigated the crystallinity and growth mechanism of the GaN films grown on CVD-grown h-BN using transmission electron microscopy and X-ray diffraction.

The exact role of Cu in the electrical properties of amorphous oxide semiconductors (AOSs) has been unclear, even though Cu has been the key element for the p-type characteristics of crystalline oxide semiconductors. Here, the dynamic changes, determined by diffusion kinetics, in the effect of Cu on the electrical properties of amorphous InGaZnO (a-IGZO) are revealed. In the early stage of annealing, Cu dominantly diffuses into a-IGZO through the free volume and acts as a mobile electron donor, which generates a resistive switching (RS) behavior related to the conductive filaments (CFs). With further annealing, substitutional Cu becomes predominant via In sites. After annealing, supersaturated Cu forms nonuniform, crystalline CuInO clusters in a-IGZO, which decrease the electrical conductivity of a-IGZO and deteriorate the CF-based RS performance. The findings reveal Cu diffusion mechanisms and the role of Cu in the electrical properties of AOSs dependent on the structural location and provide guidelines for modulating the RS characteristics of AOSs through Cu diffusion control.

We report the growth and transfer of centimeter-sized, epitaxial hexagonal boron nitride (h-BN) few-layer films using Ni(111) single-crystal substrates. The h-BN films were heteroepitaxially grown on 10 × 10 mm2 or 20 × 20 mm2 Ni(111) substrates using atmospheric pressure chemical vapor deposition with a single ammonia-borane precursor. The grown films were transferred to arbitrary substrates via an electrochemical delamination technique, and the remaining Ni(111) substrates were repeatedly re-used. A careful analysis of the growth parameters revealed that the crystallinity and area coverage of the h-BN films were mostly sensitive to the sublimation temperature of the ammonia-borane source. Moreover, various physical characterizations confirmed that the grown films exhibited the typical characteristics of hexagonal boron nitride layers over the entire area. Furthermore, the heteroepitaxial relationship between h-BN and Ni(111) and the overall crystallinity of the film were thoroughly investigated using a synchrotron radiation X-ray diffraction analysis including θ–2θ scans, grazing incident diffraction, and reciprocal space mapping. The crystallinity at the microscopic scale was further investigated using transmission electron microscopy (TEM)-based techniques, including selective area electron diffraction pattern mapping, electron back-scattered diffraction, and high-resolution TEM. Transparent and flexible ceramic films for electronic devices can now be made at centimetre scales by a low-cost technique. Hexagonal boron nitride (h-BN) crystals are attractive platforms for building next-generation circuits because their flat, graphite-like surfaces resist mechanical and chemical damage while offering excellent signal isolation. Gyu-Chul Yi from Seoul National University and colleagues have developed a way to improve large-scale manufacturing of these films using a reusable nickel template. Nickel has a surface structure that helps h-BN films grow with high crystallinity following chemical vapor deposition, but detaching the resulting ceramic layer has always proved troublesome. The Korean team solved this problem through an electrochemical delamination process that seamlessly separates h-BN films with dimensions up to 20 × 20 square millimetres using a stream of hydrogen bubbles. Centimeter-sized, epitaxial hexagonal boron nitride (h-BN) few-layer films were heteroepitaxially grown on Ni(111) single-crystal substrates using atmospheric pressure chemical vapor deposition with ammonia-borane single precursor. The grown films were transferred to arbitrary substrates via an electrochemical delamination technique, and the remaining Ni(111) substrates were repeatedly re-used. Over repeated growth and transfer after the initial annealing, no significant degradation of Ni(111) substrates was observed and the crystallinity of h-BN layers was reproduced reliably. The grown h-BN films showed typical physical characteristics of h-BN, with a high uniformity over a wide area. The large-area synthesis and transfer of atomically thin uniform epitaxial h-BN layers can be applied in various fields where high quality two-dimensional insulating layers are required.

We report the molecular beam epitaxial growth and characterization of high quality topological insulator Bi2Se3 thin films on hexagonal boron nitride (h-BN). A two-step growth was developed, enhancing both the surface coverage and crystallinity of the films on h-BN. High-resolution transmission electron microscopy study showed an atomically abrupt and epitaxial interface formation between the h-BN substrate and Bi2Se3. We performed gate tuned magnetotransport characterizations of the device fabricated on the thin film and confirmed a high mobility surface state at the Bi2Se3/h-BN interface. The Berry phase obtained from Shubnikov−de Haas oscillations suggested this interfacial electronic state is a topologically protected Dirac state.

One dimensional (1-D) semiconductor nanostructures are emerging as new candidates for the future electronic and optoelectronic devices due to their excellent physical properties, e.g. long lifetime and high efficiency, and various functionalities, e.g. flexibility and transparency [1,2]. Molecular beam epitaxy (MBE) provide accurate control over the various growth parameters, thereby allowing the growth of high-quality 1-D nanostructures with very clean and sharp interfaces [3]. Here, we grow InxGa1-xAs/InAs coaxial nanorod on graphene layers using catalyst-free MBE and investigate the chemical composition and crystal structure of nanorods using transmission electron microscope. Cross-sectional analysis shows that InxGa1-xAs coating layers have uniform thickness and cover the entire surface of the InAs core nanorods without any interfacial layers.

We report the catalyst-free growth of InAs/InxGa1−xAs coaxial nanorod heterostructures on large-area graphene layers using molecular beam epitaxy and our investigation of the chemical composition and crystal structure of these heterostructures using electron microscopy. The graphene layers used as the substrate were prepared by chemical vapor deposition and transferred onto SiO2/Si substrates. InAs nanorods and their heterostructures were grown vertically on the graphene layers; electron microscopy images revealed uniform distributions for their diameter, length and density. Cross-sectional electron microscopy images showed that InxGa1−xAs layers, having uniform composition, coated heteroepitaxially the entire surface of the InAs nanorods, without interfacial layers or structural defects. The catalyst-free growth mechanism of InAs nanorods on graphene was investigated using in situ reflection high-energy electron diffraction. Nanorods with InAs cores and InxGa1−xAs shells have been grown catalyst-free on graphene using molecular beam epitaxy by scientists in Korea. Inorganic semiconductor nanorods on graphene layers are promising for producing electronic and optoelectronic devices that are simultaneously flexible and have long lifetimes and high efficiencies. Now, researchers at Seoul National University led by Gyu-Chul Yi have realized catalyst-free molecular beam epitaxy growth of InAs/InxGa1−xAs coaxial nanorods on graphene. This is an important step as catalyst-free molecular beam epitaxy can produce ultrapure single crystals and multilayered heterostructures with precisely-controlled thickness and chemical compositions. Analysis showed that the cores and shells were clearly defined with clean interfaces and had uniform compositions and thicknesses. This demonstration opens up the path for monolithic integration of semiconductor coaxial nanorod heterostructures on two-dimensional materials. We report the catalyst-free growth of InAs/InxGa1−xAs coaxial nanorod heterostructures on large-area graphene layers using molecular beam epitaxy and our investigation of the chemical composition and crystal structure of these heterostructures using electron microscopy. Cross-sectional electron microscopy images showed that InxGa1−xAs layers, having uniform composition, coated heteroepitaxially the entire surface of the InAs nanorods, without interfacial layers or structural defects. The catalyst-free growth mechanism of InAs nanorods on graphene was investigated using in situ reflection high-energy electron diffraction.

We report the growth of high-quality, smooth, and flat ZnO thin films on graphene layers and their photoluminescence (PL) characteristics. For the growth of high-quality ZnO thin films on graphene layers, ZnO nanowalls were grown using metal-organic vapor-phase epitaxy on oxygen-plasma treated graphene layers as an intermediate layer. PL measurements were conducted at low temperatures to examine strong near-band-edge emission peaks. The full-width-at-half-maximum value of the dominant PL emission peak was as narrow as 4 meV at T = 11 K, comparable to that of the best-quality films reported previously. Furthermore, the stimulated emission of ZnO thin films on the graphene layers was observed at the low excitation energy of 180 kW/cm2 at room temperature. Their structural and optical characteristics were investigated using X-ray diffraction, transmission electron microscopy, and PL spectroscopy.