45 results on '"Gourlay, C.M."'
Search Results
2. Eutectic solidification in Mg-9Al-0.7Zn: From divorced to coupled growth
3. Al–Mn–Fe intermetallic formation in AZ91 magnesium alloys: Effects of impurity iron
4. Growth twinning and morphology of Al45Cr7 and Al13Fe4
5. Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys
6. Al2MgC2 and AlFe3C formation in AZ91 Mg alloy melted in Fe-C crucibles
7. In-situ X-ray radiography of twinned crystal growth of primary Al13Fe4
8. Rheological transitions in semi-solid alloys: In-situ imaging and LBM-DEM simulations
9. Solidification orientation relationships between Al3Ti and TiB2
10. Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium
11. Semi-solid deformation of Al-Cu alloys: A quantitative comparison between real-time imaging and coupled LBM-DEM simulations
12. Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni
13. Nucleation and growth crystallography of Al8Mn5 on B2-Al(Mn,Fe) in AZ91 magnesium alloys
14. Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds
15. Competition between stable and metastable eutectic growth in Sn-Ni alloys
16. AlSi2Sc2 intermetallic formation in Al-7Si-0.3Mg-xSc alloys and their effects on as-cast properties
17. Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
18. Grain refinement of electronic solders: The potential of combining solute with nucleant particles
19. Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates
20. Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints
21. Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
22. Dilatancy in semi-solid steels at high solid fraction
23. Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
24. Reaction-induced surface reconstruction of silver in contact with zirconium
25. Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders
26. Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles
27. Thermal etching of silver: Influence of rolling defects
28. Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
29. Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
30. Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion
31. Semi-solid deformation of Al-Cu alloys: a quantitative comparison between real-time imaging and coupled LBM-DEM simulations
32. Recommended values for the βSn solidus line in Sn-Bi alloys
33. Controlling BGA joint microstructures using seed crystals
34. Tailoring the Cu6Sn5 layer texture with Ni additions in Sn-Ag-Cu based solder joints
35. Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification
36. Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates
37. Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles
38. Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders
39. Influence of Bi additions on the distinct βSn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0–4wt%)
40. The influence of alloying elements on metastable NiSn4 in Sn-Ag solders on Ni-containing metallizations
41. Etch pitting and subsurface pore growth during the thermal etching of silver
42. Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
43. Heterogeneous nucleation of bulk Cu6Sn5 in Sn-Ag-Cu-Al and Sn-Cu-Al solders
44. NiSn4 in solder joints between Sn-3.5Ag and Ni, ENIG or ENEPIG
45. Influence of Bi additions on the distinct ?Sn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0?4wt%).
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