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Copyright of Bioeconomics & Agrarian Business / Bìoekonomìka ta Agrarnij Bìznes is the property of National University of Life & Environmental Sciences of Ukraine and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Physiological Journal / Fiziologichnyi Zhurnal is the property of O.O. Bogomoletz Institute of Physiology of the National Academy of Sciences of Ukraine and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The increasing scientific interest in Sn-based nanocomposite alloys with minor additions of oxides, metals and carbon in nanosized form is explained by the possible application of these materials as an alternative to commercial lead-free solders. As pointed out in recent literature reviews, the improved mechanical properties and reinforced microstructure of solder joints using nanocomposite Sn-Ag-Cu (SAC) alloys, compared to those without nanoinclusions, revealed new possibilities for the development of the currently used commercial lead-free solders. The main benefit of the nanosized additions is related to the suppression of the extensive growth of the Cu6Sn5 intermetallic compound (IMC) at the solder/Cu interface towards the solder side. This is achieved due to the spreading of nanoparticles over the IMC's surface, thereby suppressing the growth of Cu6Sn5 on the interface as well as in the bulk solder. In particular, the adsorbed nanoparticles on the IMC layer interface hinder the diffusion of Sn atoms from the bulk solder towards the interface and thereby suppress the IMC growth. Compared to the solid state, there is a limited number of papers dealing with experimental investigations of nanocomposite SAC solders in the liquid state after melting as well as in the semi-solid state. It has been shown that minor metal nanoadditions have an impact on the microstructure of solidified SAC solders, but practically without any significant change of the melting temperatures. The effect of small nanosized (up to 3 wt.%) nickel impurities on the electrical conductivity of Sn95.5Ag3.8Cu0.7 (SAC387) alloy has been investigated. It has been shown that the electrical conductivity gradually decreases with an increase in the impurity content of Ni. Conductivity, as a structure-sensitive transport characteristic of the liquid state of a substance, is important for modeling the processes of melting and solidification. The conductivity data provide additional information on the influence of admixtures on the structure and physicochemical properties of the metal matrix, which is important for understanding the microstructural transformations in a liquid state. Morphology of the samples was examined using REMMA-102-02 Scanning Electron Microscope- Analyzer (JCS SELMI, Sumy, Ukraine). [ABSTRACT FROM AUTHOR]

Thin-film solar cells based on chalcopyrite are promising for terrestrial and space applications. The CuInSe2 semiconductor (CIS) has a band gap of about 1.04 eV, which is somewhat smaller than the ideal value for photovoltaic solar cells. Adding Ga to CIS in order to form the CuIn1−xGaxSe2 compound (CIGS) increases the band gap width, bringing it closer to the “ideal”; increases the idle voltage but reduces the short-circuit current. However, until now the effects of Ga admixtures remain unknown. It was reported that acceptor levels in crystals CIS and CIGS are identical and donor levels in CIGS are deeper than in CIS. Therefore, doping with CIGS crystals is more difficult than with CIS crystals. Obviously, further progress in the implementation of such devices can be achieved using new technologies for producing thin films with reproducible and controllable physical parameters. In this study, crystal films CuIn0.5Ga0.5Se2 were obtained by laser deposition on dielectric substrates from presynthesized crystals. The size of the crystallites based on SEM images does not exceed 50 nm. The parameters of the tetragonal cell of the solid solution were determined and the linear increase of the tetragonal parameter was recorded. The p-type conductivity of the material was determined by the method of measuring the photodiffusion current. In the case of intensive zone-zone excitation, an emission of bound excitons from nanosized crystallites has been registered. The origin of the features of the thin-film photoluminescence spectra has been analyzed. [ABSTRACT FROM AUTHOR]

Copyright of Journal of Nano- & Electronic Physics is the property of Sumy State University and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Radio Electronics, Computer Science, Control is the property of Zaporizhzhia National Technical University and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Nanosistemi, Nanomateriali, Nanotehnologii is the property of G.V. Kurdyumov Institute for Metal Physics, N.A.S.U and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Journal of Nano- & Electronic Physics is the property of Sumy State University and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The increasing scientific interest in Sn-based nanocomposite alloys with minor additions of oxides, metals and carbon in nanosized form is explained by the possible application of these materials as an alternative to commercial lead-free solders. As pointed out in recent literature reviews, the improved mechanical properties and reinforced microstructure of solder joints using nanocomposite Sn-Ag-Cu (SAC) alloys, compared to those without nanoinclusions, revealed new possibilities for the development of the currently used commercial lead-free solders. The main benefit of the nanosized additions is related to the suppression of the extensive growth of the Cu6Sn5 intermetallic compound (IMC) at the solder/Cu interface towards the solder side. This is achieved due to the spreading of nanoparticles over the IMC's surface, thereby suppressing the growth of Cu6Sn5 on the interface as well as in the bulk solder. In particular, the adsorbed nanoparticles on the IMC layer interface hinder the diffusion of Sn atoms from the bulk solder towards the interface and thereby suppress the IMC growth. Compared to the solid state, there is a limited number of papers dealing with experimental investigations of nanocomposite SAC solders in the liquid state after melting as well as in the semi-solid state. It has been shown that minor metal nanoadditions have an impact on the microstructure of solidified SAC solders, but practically without any significant change of the melting temperatures. The effect of small nanosized (up to 3 wt.%) nickel impurities on the electrical conductivity of Sn95.5Ag3.8Cu0.7 (SAC387) alloy has been investigated. It has been shown that the electrical conductivity gradually decreases with an increase in the impurity content of Ni. Conductivity, as a structure-sensitive transport characteristic of the liquid state of a substance, is important for modeling the processes of melting and solidification. The conductivity data provide additional information on the influence of admixtures on the structure and physicochemical properties of the metal matrix, which is important for understanding the microstructural transformations in a liquid state. Morphology of the samples was examined using REMMA-102-02 Scanning Electron Microscope- Analyzer (JCS SELMI, Sumy, Ukraine). [ABSTRACT FROM AUTHOR]