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This paper is an overview of our recent investigations of liquefied wood (LW) for preparation and application of wood adhesives and wood surface finishes. For the purpose of wood bonding, poplar wood (Populus nigra L.) was liquefied with ethylene glycol (EG) and sulphuric acid. The process of the curing of LW at different conditions was characterized using differential scanning calorimetry (DSC). The effect of the press temperature and the pressing time on the shear strength of bonds was monitored after the bonding of 5mm thick beech (Fagus sylvatica L.) lamellas. According to the results of DSC measurements, the curing process of the LW took place in two phases. In the initial physical phase the removal of water and EG from the LW occurred. This phase was followed by an exothermic chemical reaction. It was found that the optimum conditions for bonding beech lamellas were: a ratio between poplar and EG of 1:1, a press temperature of 180°C, and a pressing time of 12 minutes. Using such conditions it was possible to obtain bonds with a dry shear strength of about 7N/mm². For preparation of polyurethane wood coatings, poplar wood was liquefied with diethylene glycol (DEG) and the excessive DEG was removed from the reaction mixture prior to curing with isocyanate type hardener. For the purpose of preparation of light-coloured polyurethane coatings from bleached liquefied wood, liquefaction of wood was conducted with a mixture of polyethylene glycol (PEG) and glycerol (GLY) at a 9:1 ratio. Both LW based PU coatings and bleached LW based PU finishes were in the most relevant properties comparable to commercial polyurethane wood coatings. [ABSTRACT FROM AUTHOR]

In this study, we modified melamine-formaldehyde (MF) resin adhesive with liquefied wood (LW) and determined the properties of MF–LW adhesive mixtures. Furthermore, we produced particleboards using prepared MF–LW mixtures and evaluated their mechanical and physical properties. Results showed that with increasing content of LW in the adhesive mixture gel time and peak temperature increased while reaction enthalpy decreased. With increasing substitution of MF resin adhesive with LW the thermal stability of adhesive mixture reduced, namely thermal degradation started at lower temperature and weight loss increased. Properties of particleboards improved with increasing amount of LW in the adhesive mixture up to 20% and then deteriorated. Nevertheless, the properties of particleboard with 30% LW in the adhesive mixture were comparable to the properties of particleboard without LW while they worsen at greater portion of LW. Consequently, MF resin adhesive with 30% LW substitution could be used to produce particleboards with suitable mechanical properties and reduced formaldehyde release content. [ABSTRACT FROM PUBLISHER]