42 results on '"Zschech, Ehrenfried"'
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2. X-Ray Diffractional Investigation of the Copper-Aluminium Interface Reaction
3. X-ray Reflectivity Characterisation of Thin-Film and Multilayer Structures
4. Materials Characterization by Ellipsometry
5. Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section
6. Thermal Desorption Spectrometry as a Method of Analysis for Advanced Interconnect Materials
7. Advanced Material Characterization by TOFSIMS in Microelectronic
8. Electronic Properties of the Interface Formed by Pr2O3 Growth on Si(001), Si(111) and SiC(0001) Surfaces
9. The Importance of Polymers in Wafer-Level Packaging
10. Challenges to Advanced Materials Characterization for ULSI Applications
11. Packaging Materials: Organic-Inorganic Hybrids for Millimetre-Wave Optoelectronics
12. Organic Nonvolatile Memories
13. Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding
14. Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction
15. Electrically Conductive Adhesives as Solder Alternative: A Feasible Challenge
16. The Role of Au/Sn Solder in Packaging
17. Dielectric and Scaling Effects on Electromigration for Cu Interconnects
18. Carbon Nanotube Via Technologies for Future LSI Interconnects
19. Advanced Barriers for Copper Interconnects
20. Nickel Nanowires Obtained by Template Synthesis
21. Synthesis and Characterization of Compounds Obtained by Crosslinking of Polymethylhydrosiloxane by Aromatic Rings
22. Revealing the Porous Structure of Low-k Materials Through Solvent Diffusion
23. Conductivity Enhancement in Metallization Structures of Regular Grains
24. Stress Modeling for Copper Interconnect Structures
25. Scaling of Ferroelectric-based Memory Concepts
26. Interconnect Technology — Today, Recent Advances and a Look into the Future
27. Amorphous-to-fcc Transition in GeSbTe Alloys
28. Device Concepts with Magnetic Tunnel Junctions
29. Phase-change Memories
30. Floating-dot Memory Transistors on SOI Substrate
31. Ion-beam Synthesis of Nanocrystals for Multidot Memory Structures
32. Silicides — Recent Advances and Prospects
33. An Introduction to Nonvolatile Memory Technology
34. Selective Airgaps: Towards a Scalable Low-k Solution
35. Surface Engineering Using Self-assembled Monolayers: Model Substrates for Atomic-layer Deposition
36. Atomic-layer Deposited Barrier and Seed Layers for Interconnects
37. Pushing PVD to the Limits — Recent Advances
38. Copper CVD for Conformal Ultrathin-film Deposition
39. Thin-film Engineering by Atomic-layer Deposition for Ultra-scaled and Novel Devices
40. LEPECVD — A Production Technique for SiGe MOSFETs and MODFETs
41. Molecular-beam Deposition of High-k Gate Dielectrics for Advanced CMOS
42. TEM Characterization of Strained Silicon
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