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89,257 results on '"WAFER"'

1. Wafer Manufacturing : Shaping of Single Crystal Silicon Wafers

Author

Imin Kao, Chunhui Chung, Imin Kao, and Chunhui Chung

Subjects
Semiconductor wafers--Design and construction
Abstract

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Published
2019

2. Wafer Fabrication : Automatic Material Handling System

Author

Jie Zhang and Jie Zhang

Subjects
Semiconductor wafers--Automatic control, Manufacturing processes--Automatic control
Abstract

This book systematically introduces modeling, performance evaluation and applications of Automatic Materiel Handling System (AMHS) in semiconductor manufactucing, and focuses discussion on the coordination of two subsystems. Resources dispatch and optimization are conducted on operational research combined with cases studies. Written in a practical way, it is an essential reference for researchers and engineers in manufacturing and management.

Published
2018

3. Wafer Bonding : Applications and Technology

Author

Marin Alexe, Ulrich Gösele, Marin Alexe, and Ulrich Gösele

Subjects
Semiconductors--Bonding, Semiconductor wafers
Abstract

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Published
2013

6. A Hybrid Multi-objective Genetic Algorithm Combined with Dispatching Rule for Wafer Test Scheduling

Author

Chen, Chun-An, Wang, Hung-Kai, Wu, Chia-Le, Chaari, Fakher, Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Haddar, Mohamed, Series Editor, Cavas-Martínez, Francisco, Editorial Board Member, di Mare, Francesca, Editorial Board Member, Kwon, Young W., Editorial Board Member, Tolio, Tullio A.M., Editorial Board Member, Trojanowska, Justyna, Editorial Board Member, Schmitt, Robert, Editorial Board Member, Xu, Jinyang, Editorial Board Member, Chien, Chen-Fu, editor, Dou, Runliang, editor, and Luo, Li, editor

Published
2024
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7. Silicon Wafer Processing

Author

Yang, Deren, Liang, Xingbo, Yu, Xuegong, Wang, Yangyuan, editor, Chi, Min-Hwa, editor, Lou, Jesse Jen-Chung, editor, and Chen, Chun-Zhang, editor

Published
2024
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9. The Classification of Semiconductor Wafer Defects by Means of Feature-based Transfer Learning Approach

Author

Xuen, Lim Shi, Jizat, Jesnor Arif Mat, Khairuddin, Ismail Mohd, Nasir, Ahmad Fakhri Ab., Razman, Mohd Azraai Mohd, Taha, Zahari, Yuen, Edmund, Majeed, Anwar P. P. Abdul, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Abdul Majeed, Anwar P.P., editor, Yap, Eng Hwa, editor, Liu, Pengcheng, editor, Huang, Xiaowei, editor, Nguyen, Anh, editor, Chen, Wei, editor, and Kim, Ue-Hwan, editor

Published
2024
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11. Super-Resolution Methods for Wafer Transmission Electron Microscopy Images

Author

Kim, Sungsu, Baek, Insung, Cho, Hansam, Roh, Heejoong, Kim, Kyunghye, Jo, Munki, Tae, Jaeung, Kim, Seoung Bum, Hartmanis, Juris, Founding Editor, van Leeuwen, Jan, Series Editor, Hutchison, David, Editorial Board Member, Kanade, Takeo, Editorial Board Member, Kittler, Josef, Editorial Board Member, Kleinberg, Jon M., Editorial Board Member, Kobsa, Alfred, Series Editor, Mattern, Friedemann, Editorial Board Member, Mitchell, John C., Editorial Board Member, Naor, Moni, Editorial Board Member, Nierstrasz, Oscar, Series Editor, Pandu Rangan, C., Editorial Board Member, Sudan, Madhu, Series Editor, Terzopoulos, Demetri, Editorial Board Member, Tygar, Doug, Editorial Board Member, Weikum, Gerhard, Series Editor, Vardi, Moshe Y, Series Editor, Goos, Gerhard, Founding Editor, Bertino, Elisa, Editorial Board Member, Gao, Wen, Editorial Board Member, Steffen, Bernhard, Editorial Board Member, Yung, Moti, Editorial Board Member, Woeginger, Gerhard, Editorial Board Member, Fujita, Hamido, editor, Cimler, Richard, editor, Hernandez-Matamoros, Andres, editor, and Ali, Moonis, editor

Published
2024
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12. Boundary-Focused Semantic Segmentation for Limited Wafer Transmission Electron Microscope Images

Author

Jo, Yongwon, Bae, Jinsoo, Cho, Hansam, Roh, Heejoong, Kim, Kyunghye, Jo, Munki, Tae, Jaeung, Kim, Seoung Bum, Hartmanis, Juris, Founding Editor, van Leeuwen, Jan, Series Editor, Hutchison, David, Editorial Board Member, Kanade, Takeo, Editorial Board Member, Kittler, Josef, Editorial Board Member, Kleinberg, Jon M., Editorial Board Member, Kobsa, Alfred, Series Editor, Mattern, Friedemann, Editorial Board Member, Mitchell, John C., Editorial Board Member, Naor, Moni, Editorial Board Member, Nierstrasz, Oscar, Series Editor, Pandu Rangan, C., Editorial Board Member, Sudan, Madhu, Series Editor, Terzopoulos, Demetri, Editorial Board Member, Tygar, Doug, Editorial Board Member, Weikum, Gerhard, Series Editor, Vardi, Moshe Y, Series Editor, Goos, Gerhard, Founding Editor, Bertino, Elisa, Editorial Board Member, Gao, Wen, Editorial Board Member, Steffen, Bernhard, Editorial Board Member, Yung, Moti, Editorial Board Member, Woeginger, Gerhard, Editorial Board Member, Fujita, Hamido, editor, Cimler, Richard, editor, Hernandez-Matamoros, Andres, editor, and Ali, Moonis, editor

Published
2024
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15. Deep Learning-Based Silicon Wafer Defect Classification: A Performance Comparison of Pretrained Networks

Author

Ang, Koon Hian, Ang, Koon Meng, Ang, Chun Kit, Chong, Kim Soon, Sharma, Abhishek, Lim, Tiong Hoo, Tiang, Sew Sun, Lim, Wei Hong, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Tan, Andrew, editor, Zhu, Fan, editor, Jiang, Haochuan, editor, Mostafa, Kazi, editor, Yap, Eng Hwa, editor, Chen, Leo, editor, Olule, Lillian J. A., editor, and Myung, Hyun, editor

Published
2024
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16. A Learning-Based Approach for Wafer Defect Detection in Production Quality Control

Author

Yen, Hoang Hai, Nguyen, Nguyen Khai, Tram, Pham Bao, Vi, Tran Duc, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Nanda, Satyasai Jagannath, editor, Yadav, Rajendra Prasad, editor, Gandomi, Amir H., editor, and Saraswat, Mukesh, editor

Published
2024
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18. Towards Zero-Defect Manufacturing in the Silicon Wafer Production Through Calibration Measurement Process: An Italian Case

Author

Acerbi, Federica, Pranzo, Andrea, Sanna, Cristina, Spaltini, Marco, Taisch, Marco, Rannenberg, Kai, Editor-in-Chief, Soares Barbosa, Luís, Editorial Board Member, Carette, Jacques, Editorial Board Member, Tatnall, Arthur, Editorial Board Member, Neuhold, Erich J., Editorial Board Member, Stiller, Burkhard, Editorial Board Member, Stettner, Lukasz, Editorial Board Member, Pries-Heje, Jan, Editorial Board Member, Kreps, David, Editorial Board Member, Rettberg, Achim, Editorial Board Member, Furnell, Steven, Editorial Board Member, Mercier-Laurent, Eunika, Editorial Board Member, Winckler, Marco, Editorial Board Member, Malaka, Rainer, Editorial Board Member, Danjou, Christophe, editor, Harik, Ramy, editor, Nyffenegger, Felix, editor, Rivest, Louis, editor, and Bouras, Abdelaziz, editor

Published
2024
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20. Machine Learning and Deep Networks for Additive Wafer Defect Detection: A Concise Study

Author

Pal, Bandana, Gooel, Nidhi, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Tan, Kay Chen, Series Editor, Jain, Shruti, editor, Marriwala, Nikhil, editor, Singh, Pushpendra, editor, Tripathi, C.C., editor, and Kumar, Dinesh, editor

Published
2024
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25. Wafer Paper Cakes : Modern Cake Designs and Techniques for Wafer Paper Flowers and More

Author

Stevi Auble and Stevi Auble

Subjects
Decoration and ornament, Cake decorating
Abstract

Master the techniques you need to create astonishing cakes using wafer paper. Stevi Auble of innovative boutique bakery Hey There, Cupcake! demonstrates how, using a few sheets of edible paper and some basic cake decorating tools, you can take your skills to new creative heights. Illustrated with over three hundred photographs, this lavish guide will take you step-by-step though how to make eighteen exquisite paper flowers and leaves, plus other decorations such as bows, wreaths and cake toppers. You'll also learn how to create some incredible textures in wafer paper including ruffles, lace and metallic effects. Once you've mastered the skills, twelve simple yet spectacular cake decorating projects will show you how to put the wafer paper elements together into contemporary cake designs, and excel your cake decorating repertoire!

Published
2017

26. A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding

Author

Chaudhuri, Debika, Rahaman, Hafizur, Ghosh, Tamal, Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Giri, Chandan, editor, Iizuka, Takahiro, editor, Rahaman, Hafizur, editor, and Bhattacharya, Bhargab B., editor

Published
2023
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31. Wafer Scale Integration

Author

Earl E. Swartzlander Jr and Earl E. Swartzlander Jr

Subjects
Integrated circuits--Wafer-scale integration
Abstract

Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.

Published
2012

32. The Classification of Wafer Defects: An Evaluation of Different Feature-Based ResNet Transfer Learning Models with Support Vector Machine

Author

Xuen, Lim Shi, Mohd Khairuddin, Ismail, Mohd Razman, Mohd Azraai, Mat Jizat, Jessnor Arif, Yuen, Edmund, Yap, Eng Hwa, Tan, Andrew Huey Ping, Abdul Majeed, Anwar P. P., Angrisani, Leopoldo, Series Editor, Arteaga, Marco, Series Editor, Panigrahi, Bijaya Ketan, Series Editor, Chakraborty, Samarjit, Series Editor, Chen, Jiming, Series Editor, Chen, Shanben, Series Editor, Chen, Tan Kay, Series Editor, Dillmann, Rüdiger, Series Editor, Duan, Haibin, Series Editor, Ferrari, Gianluigi, Series Editor, Ferre, Manuel, Series Editor, Hirche, Sandra, Series Editor, Jabbari, Faryar, Series Editor, Jia, Limin, Series Editor, Kacprzyk, Janusz, Series Editor, Khamis, Alaa, Series Editor, Kroeger, Torsten, Series Editor, Li, Yong, Series Editor, Liang, Qilian, Series Editor, Martín, Ferran, Series Editor, Ming, Tan Cher, Series Editor, Minker, Wolfgang, Series Editor, Misra, Pradeep, Series Editor, Möller, Sebastian, Series Editor, Mukhopadhyay, Subhas, Series Editor, Ning, Cun-Zheng, Series Editor, Nishida, Toyoaki, Series Editor, Oneto, Luca, Series Editor, Pascucci, Federica, Series Editor, Qin, Yong, Series Editor, Seng, Gan Woon, Series Editor, Speidel, Joachim, Series Editor, Veiga, Germano, Series Editor, Wu, Haitao, Series Editor, Zamboni, Walter, Series Editor, Zhang, Junjie James, Series Editor, Abdullah, Muhammad Amirul, editor, Khairuddin, Ismail Mohd., editor, Ab. Nasir, Ahmad Fakhri, editor, Mohd. Isa, Wan Hasbullah, editor, Mohd. Razman, Mohd. Azraai, editor, Rasid, Mohd. Azri Hizami, editor, Zainal, Sheikh Muhammad Hafiz Fahami, editor, Bentley, Barry, editor, and Liu, Pengcheng, editor

Published
2023
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33. The Classification of Wafer Defects: A Support Vector Machine with Different DenseNet Transfer Learning Models Evaluation

Author

Xuen, Lim Shi, Mohd Khairuddin, Ismail, Mohd Razman, Mohd Azraai, Mat Jizat, Jessnor Arif, Yuen, Edmund, Jiang, Haochuan, Yap, Eng Hwa, P. P. Abdul Majeed, Anwar, Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, Jo, Jun, editor, Choi, Han-Lim, editor, Helbig, Marde, editor, Oh, Hyondong, editor, Hwangbo, Jemin, editor, Lee, Chang-Hun, editor, and Stantic, Bela, editor

Published
2023
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34. Developing a Prototype Piezoelectric Wafer-Box for Optimal Energy Harvesting

Author

Ahmad, S., Seonghoon, K., Mohammad, A., Junan, S., Yong, B., Kacprzyk, Janusz, Series Editor, Gomide, Fernando, Advisory Editor, Kaynak, Okyay, Advisory Editor, Liu, Derong, Advisory Editor, Pedrycz, Witold, Advisory Editor, Polycarpou, Marios M., Advisory Editor, Rudas, Imre J., Advisory Editor, Wang, Jun, Advisory Editor, and Arai, Kohei, editor

Published
2023
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46. Prediction of Wafer Map Categories Using Wafer Acceptance Test Parameters in Semiconductor Manufacturing

Author

Lim, Martin Ying Song, Sharma, Anurag, Chin, Cheng Siong, Yip, Tommy Chun Ming, Ong, Jonathan Yoong Seang, Rannenberg, Kai, Editor-in-Chief, Soares Barbosa, Luís, Editorial Board Member, Goedicke, Michael, Editorial Board Member, Tatnall, Arthur, Editorial Board Member, Neuhold, Erich J., Editorial Board Member, Stiller, Burkhard, Editorial Board Member, Tröltzsch, Fredi, Editorial Board Member, Pries-Heje, Jan, Editorial Board Member, Kreps, David, Editorial Board Member, Reis, Ricardo, Editorial Board Member, Furnell, Steven, Editorial Board Member, Mercier-Laurent, Eunika, Editorial Board Member, Winckler, Marco, Editorial Board Member, Malaka, Rainer, Editorial Board Member, Maglogiannis, Ilias, editor, Iliadis, Lazaros, editor, Macintyre, John, editor, and Cortez, Paulo, editor

Published
2022
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50. Handbook of Wafer Bonding

Author

Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo, Peter Ramm, James Jian-Qiang Lu, and Maaike M. V. Taklo

Subjects
Semiconductor wafers--Handbooks, manuals, etc, Semiconductors--Bonding--Handbooks, manuals, etc
Abstract

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Published
2012

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