46 results on '"Hockett, Mike"'
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2. RETURNING THE POWER: Vendors constantly challenged to find efficiency gains in regenerative power supplies & loads.
3. INFLUX OF ELECTRONICS REDEFINES 'AUTOMOTIVE': Vendors discuss technology developments, challenges, and new solutions in automotive test & design.
4. SMALL, BUT MIGHTY: Portable instrumentation vendors challenged to pack robust features into small form factors.
5. 2019 Evaluation Engineering's JOB REPORT.
6. RETURNING THE POWER.
7. VENDORS RAMP UP MMWAVE FUNCTIONALITY, RTSA OFFERINGS IN SOLUTIONS.
8. MEA, INSTRUMENT CONSOLIDATION PUSHING VENDORS TO INNOVATE.
9. SEMICONDUCTOR TEST: VENDORS CHALLENGED BY COST OF TEST AMID INCREASING DEVICE COMPLEXITY.
10. TESTING FOR THE FUTURE: 5G brings onslaught of challenges in RF/microwave testing.
11. DATA DEMANDS: Turnkey use, portability, and real-time analysis among customers' DAQ must-haves.
12. LET'S GET MODULAR: As 5G and IIoT keep evolving, the demand for modular instrumentation grows to new heights.
13. A HIGHER POWER: Power semiconductor test vendors discuss trends and challenges in SiC, GaN, IGBT, and more.
14. TOP OF THE CLASS: Innovations empower high-end oscilloscopes to serve demanding applications.
15. POWER PLAY: Programmable power supplies & loads vendors tackle renewable energy, power efficiency.
16. WHERE THE CHIP MEETS THE BOARD: EE's sights from DesignCon.
17. SAFETY FIRST: Electrical safety test vendors packing value-adds into solutions.
18. SWITCHING VENDORS CHALLENGED TO MEET BANDWIDTH DEMANDS.
19. FREQUENCY REQUIREMENTS, LOWER COSTS DRIVING VNA TRENOS.
20. PAM4, PCIE, JITTER LIMITS MOVE THE NEEDLE IN HIGH-SPEED DIGITAL.
21. Once high-end scope features now becoming mainstream.
22. ManyT&M challenges to overcome before true 5G rollout.
23. Cost of test still biggest hurdle as newer factors add to challenges.
24. Multifunctionality, portability driving signal generator developments.
25. THE OPTICS ARE GOOD: Vendors weigh in on developments in optical communications technology and test solutions.
26. Q&A: 5G ANTENNA MINIATURIZATION, COMPONENT VALIDATION ARE LATEST WRINKLES IN RF/MICROWAVE TEST.
27. THE OPTICS ARE GOOD.
28. CISPR COMPLIANCE, REAL-TIME ANALYSIS DRIVING INNOVATION IN EMI/EMC INSTRUMENTS.
29. EE'S SIGHTS FROM APEC 2019.
30. THE NEED FOR PCB ASSEMBLY SPEED: Tempo Automation is helping bring products to market faster than ever.
31. TELEMETRY, DIGITALIZATION DRIVING CHANGE IN MEDICAL TEST.
32. Q&A: SIMULATION'S VITAL ROLE IN WIRELESS TESTING.
33. CYBERSECURITY: SHIELDING AGAINST THE DARK SIDE.
34. 2019 5G PREDICTIONS.
35. BY THE NUMBERS.
36. EE digs into job data.
37. More electric aircraft = more challenges.
38. Following up on "brain drain" in test engineering.
39. How safe are 5G signals?
40. The current state of 5G wireless service.
41. Test engineering facing issues of "brain drain," talent gap.
42. 5G infrastructure providers positioned to win big.
43. Cobots and humans: Can we get along?
44. Testing for Mars.
45. My own Internet of Things.
46. Cybersecurity an IoT world.
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