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The article reports on the benefits of the method of joining two glass panes to each other and to the door components using the double sided, adhesive-coated, urethane-foam tape made by Norwood Industries Inc. The use of this foam tape will minimize the door's conductive heat losses and seal the joints between the two panes preventing air from leaking. It also function as thermal and moisture barrier. The foam incorporate a special moisture-absorbing additive that reduces condensation on exposed metal and glass surfaces.

The article provides information on PCM45F-SP, a phase-change material developed by Honeywell Electronic Materials as of April 2006. The product can be applied by engineers using a printing process, making it more adaptable to integrated circuit designs than traditional thermal-management materials that come on tape rolls. It can assume a variety of shapes based on the screen print of the chip. The materials provide higher production efficiency and better thermal performance than thermal-management products.

This article focuses on new products to tame the thermal density of end products caused by miniaturization and performance demands, introduced by several companies at the Electro '92. Elmwood Sensors Inc., introduced a line of patented solid-state thermal sensors. Thermalloy Cooling Module that offers up to nine times better performance than a heat sink. Big Industries Inc., introduced the Temprobe temperature kit that provides a means of rapid data acquisition without wiring or readout devices.