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The article offers information on Model 1525 Series accelerometers from Silicon Designs Inc., LV-45 Series linear position sensor from Alliance Sensors Group, and STS35 temperature sensor from Sensirion.

The article offers brief information on several eddy-current measurement-based accelerometers including the AAA545 solid-state accelerometers from Altheris Sensors and Controls, the Model MAV52 amplified piezoelectric accelerometer from Honeywell Sensing and Control, and the EK-P4 sensor evaluation kit from Sensirion.

The article reports that a system-level approach is exciting the technology of microelectromechanical system (MEMS) devices, which involves the integration of MEMS-based sensors, actuators and structures with functions, like processing and packaging. It mentions that MEMS accelerometers, gyroscopes and inertial management units (IMUs) are becoming smaller and sophisticated with better performance.

The article presents information on inertial sensors or inertial measurement unit (IMU) and discusses how coaches and athletes can use data from IMU to improve sports training. It is informed that inertial sensors are micro-electromechanical systems (MEMS) with tiny accelerometers and angular rate gyros that are combined to form a complete IMU. It is reported that an IMU detects three-dimensional motion of a body in space. IMU measures acceleration of one point on the body and the angular velocity of the body.

The article describes a prototype microprocessor-based baby-monitoring system that can be used to address the suggested causes of sudden-infant-death syndrome (SIDS). Based on research, ensuring that infants sleep on their backs and removing objects that might suffocate them can prevent SIDS. A temperature sensor, accelerometer and a wireless transmitter/receiver in a microcontroller are included in the monitoring unit. It notes the efficiency of data transmission between the units.

The article explains several specifications that need to be considered when selecting an accelerometer. One specification is the sensitivity of the accelerometer, which refers to the ratio of the sensor's electrical output to mechanical output. It is also the reference sensitivity when it refers to the percentage or decibel tolerance band of frequency response specifications. Frequency response, in similarity to the sensitivity specification, tells what the accelerometer's scale factor is, but with added variable of frequency. Other specifications include transverse sensitivity, mounted resonance frequency and amplitude linearity.

The article discusses the benefits of accelerometers combined with mechanical or electronic controls which can lead to smarter user interfaces and controls. The applications of motion-recognition systems are discussed. A motion-sensor block diagram is presented. The article also covers the use of accelerometers for security.

Focuses on the application of microelectromechanical system (MEMS) motion sensors in increasing the usability and reliability of mobile telephones. Addition of gesture recognition commands to a handset through the adoption of a MEMS accelerometer supported by new functions implemented in software; Use of an accelerometer as an input to control the system cursor or as a game input; Capability of an accelerometer to detect if the handset is falling.

This article discusses the evolution of inertial sensors into low-generation accelerometer integrated circuits (IC). Before the arrival of the first generation of microelectromechanical-systems (MEMS) devices, the most common inertial sensors were accelerometers formed of piezoelectric film. The first successful commercialized MEMS inertial sensors proved that fabricators could build sensors smaller and lighter than their predecessors and do so on conceptually simple variations of standard IC process. First-generation IC accelerometers provided limited sensitivity, exhibited marginal signal-to-noise ratio, depended on expensive and immature processes and required large and expensive through-hole packages. Since the first IC accelerometers that met with market success, sensor markers have been developing more advanced processes, sensor designs, signal-conditioning circuitry and packaging technologies. The results are low-generation sensors that have opened a large number of applications in several market segments. Security applications include motion sensing for briefcases, laptop computers and other portable equipment, as well as tilt sensing for automobile antitheft systems. Applications in mobile telephones and personal digital assistants include hand-gesture sensing for bottomless scrolling and device control, context detection and gaming. INSETS: AT A GLANCE;MEASURING MOTION.

The article essays the growth of automotive electronic systems. Topics discussed include the need for clean burning engine in the mid 70's and the subsequent introduction of electronic engine control (EEC), market data on automotive electronic sensor application, the components of today's high-volume applications including the manifold absolute pressure (MAP) sensors, airbag accelerometers, tire-pressure monitors, and yaw-rate sensors, and several future sensor-based applications.

Reports on Market Intelligence Research Corp.'s analysis of the worldwide sensor markets. Annual growth pattern of the sensor markets; Market segments of imaging sensors, accelerometers and chemical and gas sensors; Market growth in North America and Europe.

The article features the MEMSIC MFA1100R gas-flow sensor which uses the thermal principle of operation similar to that of the thermal accelerometer of MEMSIC Inc. The sensors based on thermal microelectromechanical systems (MEMS) have the capacity to provide motion sensing in accelerometers. Gas-flow measurement is needed in the medical market such as that in anesthesia delivery, chromatography, sleep apnea, spirometers, and ventilators.

The article reports on the technology utilized by the Boeing 787 Dreamliner to address wind gust and motion sickness during travel. It was inferred that Boeing engineers have installed control systems such as sensors and accelerometers that monitor the movement of the airplane and its response to wind pressure. It states that the systems also help engineers to develop solutions by controlling the pressure of wind gust on the aircraft. In addition, the cause of motion sickness was also discussed.

The article reviews several sensors used to measure conditions like acceleration and pressure including the ILPS-19 Series sensors by Harold G. Schaevitz; the 357A64 extreme-temperature accelerometers by PCB Piezotronics; and the ICP-10100 microelectromechanical systems sensor by InvenSense.

The article discusses the Sensors Expo 2016 trade show held in June 2016 in San Jose, California, and reviews the sensors that were showcased in the exposition, including the D7S vibration sensor from Omron Electronic Components, 624x accelerometers and tilt switches from MEMSIC, and the DigiPyro PYD 1500 Series of battery-operated motion detectors from Excelitas Technologies.

The article introduces the concept of sensor fusion, a creative engineering technology which combines sensor data from various system sensors for more accurate, complete and dependable sensor signals, within a smartphone context. It explores how sensor fushion software is used to improve overall accuracy. It also introduces a test method which uses a fushion library based on sensor signals from accelerometers, magnetometers and gyroscopes.

The article discusses the use of micro-electromechanical system-application-specific integrated circuit (MEMS-ASIC) technology to deliver motion sensors in integrated accelerometers, magnetic sensors and gyroscopes. Topics discussed include the potential of single-chip accelerometers and the wearables market driving the growth in the MEMS accelerometer business.

The article focuses on a study by Oliver O'Reilly, professor of mechanical engineering at the University of California, Berkeley, regarding attachment of sensors in shoelaces. It mentions that variables related to staggering such as shoelace type, shoe type, and fitness level. It also presents the views of O'Reilly regarding the use of accelerometer to laces for calculating its inertia and impact.

The article features several sensors and transducers, including the MP45DT01 MEMS digital-output stereo microphone from STMicroelectronics, the A1230 dual-channel bipolar switch from Allegro MicroSystems and the three-axis LIS3DH digital-output accelerometer from STMicroelectronics.

The article evaluates several solid state sensors including the MMA7261Q GP microelectromechanical system (MEMS)-based accelerometers from Freescale Inc., the SpeciMinder robot from Cypress Semiconductor Corp., and the Aquaboost I and II from Goulds Pumps Inc.

The article offers information on various electronic sensors and transducers including the D6f microelectromechanical-system (MEMS) flow sensors from Omron Electronic Components, the M-300 ultrasonic-sensor family from Massa Corp. and the MMA 73xOL XYZ-axis accelerometers from Freescale Semiconductor.

The article explains how a current-mode instrumentation amplifier enhances a piezoelectric accelerometer. It states that a piezoelectric sensor comprises a disk of PZT-5A ceramic material with metallized electrodes on its surfaces. External wiring connects to the sensor when electrically conductive epoxy is applied to the electrodes. When the piezoelectric disk is mounted on a target structure, it serves as a simple force sensor and accelerometer by producing a voltage that is directly proportional to the force acting parallel to the direction of polarization of the disk.

The article evaluates several electronic instruments including Freescale Semiconductor's MMA7260Q 3-axis acceleration sensor, ADXL210 accelerometer and ADXL210 accelerometer from Analog Devices, and MicroStrain's FAS-A Inclinometer.

The article focuses on the MMA7260Q three-axis acceleration sensor, that combines low-level sensing, low power dissipation, low noise, low cost, and a very low profile. Freescale Semiconductor Inc.'s single-package, two-chip MMA7260Q features the sensing unit on top of the control chip. Cost is $4.25 each in 1000-unit lots. Low-g sensing is a tough technical challenge for design engineers, requiring extremely sensitive sensors with low noise levels and very small footprints. Because these sensors target consumer items, they also must be cost-conscious while dissipating very little power. The development of low-cost and miniature three-axis accelerometers raises the possibility of putting gyroscopes in handheld consumer electronics, such as cell phones. Even though there may not seem to be a strong demand in today's consumer market, falling chip prices may soon change this scenario. Gyroscopes are primarily used to provide rotational detection in military, aviation, industrial and biomedical applications.

Deals with a gyroscope developed by Crossbow Technologies which combines silicon-micromachined accelerometers and coriolis-effect angular-rate sensors. How the equipment works; How the firmware compensate for drift.

The article reports on how video-based non-contact kinematic measurement system enabled engineers to ascertain the acceleration and lateral displacement of earthquake-damaged freeway structures. The system was developed by Motion Analysis Corp. (MAC) as an initiative to address the problem on time-consuming and expensive conventional accelerometers and displacement detectors.

Highlights a range of sensors, transducers, thermistors and accelerometers. Information on the MS 1600 accelerometer, an ultra-miniature silicon microelectromechanical device combined with application specific integrated circuit (ASCI); Functions of several thermistors from Victory Engineering Inc.; Features of the amplified pressure sensor from Honeywell Micro Switch Division; Details on the MUT-03B transducer; Price range of these components.

The article evaluates the Endevco models 74 and 75 triaxial piezoresistive shock accelerometers from Meggitt Sensing Systems, a leading supplier of sensing and monitoring systems.

The article focuses on sensor fusion in healthcare application. It states that sensor fusion works by providing users an improved experience, combining and leveraging three-dimensional (3D) magnetometers, 3D gyroscopes, and 3D accelerometers. It mentions that several types of body worn sensors including thermometers, electromyogram (EMG), and electrocardiogram (ECG) are utilized in clinical setting for the rehabilitation and monitoring of gait, the pattern of arm's motion upon movement.

The article discusses the use of accelerometers by engineers in the U.S. It monitors the operation of large rotating equipment such as motors, pumps and rollers. Accelerometers use several sensor technologies and can offers raw, unconditioned and conditioned outputs in digital form. Accelerometers will also assess the effects of traffic on a bridge or seismic disturbances.

The article discusses the advantage of using microelectromechanical systems (MEMS) in the U.S. It generates their own energy and applicable in several areas that need small sensors and accelerometers. According to Yole Development analysts Laurent Robin, MEMS can function a variety of industries since they are already available in building and home automation. In military and aerospace applications, vibrations can be harvested to power a detector as a health and usage monitoring system.

The article reports on the installation by researchers in Dresden, Germany of sensors into a tram to gather vibration and temperature information. The move is intended to make future trams quieter and more energy efficient. Piezo-electrical triaxial accelerometers were supplied by Kistler to measure strain in the vehicle structure in the region of the carriage body. The Institute for Rail Transport and Technology, Bombardier and Hartin Electric were all involved in the project.

The article reports on the move of Robery Bosch GmbH to reduce cost and packaging requirements of electronic stability by integrating the inertial sensor cluster into the electronic control unit in Europe. It states that the inertial sensor cluster, comprising accelerometers and yaw rate sensors, normally sits in a separate module. It adds that by integrating it, the electronic architecture becomes simpler and assembly can be quicker.

The article announces the completion of three test firings of small missile-like probes by engineers at the Ministry of Defence (MoD) in Pendine, South Wales in May 2008. The probes, called penetrators, will allow scientific measurements to be taken from the far side of the Moon, and are for the proposed British-led Moonlite mission to the Moon that could be ready for launch in 2013. According to the article, Qinetiq, which operated and managed the long test track facility, is de-risking the mission using computer models as well as trials at the test and evaluation facilities at Pendine. The penetrators tested contained accelerometers, a data acquisition system, a power system and sensors, including a drill mechanism, seismometer and mass spectrometer.

The article reports on the move taken by sensor suppliers in rolling out smaller three-axis accelerometers as the demand for smaller sensors in several applications goes higher. In connection, engineers are finding applications for the fingernail-sized devices in laptop computers, cell phones, washing machines as well as a host of other products.

The article features the Hot Hand accelerometer for electric guitar players from Analog Devices. The device provides flexibility to guitar players in shaping the sounds. Moreover, it detects accelerations of sensing motion and tilt of the guitar player's hand. The cutoff frequency of the device can be adjusted by guitarists to match a playing style.

The article reports that Endevco has introduced the model 71 series surface mount accelerometer, a new subminiature addition to its line of high shock sensors for extreme aerospace and test and measurement applications. The product is micro-machined from a single piece of silicon which includes inertial mass and strain gauges arranged in an active, four-arm, Wheatstone bridge circuit complete with an innovative on-chip zero balance network. The low mass, extremely small size and unique construction of the product blends an exceptionally high resonant frequency with characteristics such as low output impedance, high over range and zero damping for no phase shift.

The article focuses on motion-controlled guitar effects. The idea was hatched by the company Source Audio LLC. The company's founders are former Analog Devices (ADI) engineers Jesse Remignanti and Roger Smith. Bob Chidlaw, former Chief scientist at Kurzweil was recruited to provide help in refining the digital music effects. The product labelled as the Hot Hand controller embeds an accelerometer into a ring which can be worn on the picking hand. Hot Hand uses ADI iMems sensors. The ADXL320 sensor provides low power in a small package for Source Audio. This makes it suitable for incorporation in a pick-hand ring.

The article reports the claim of Emerson Co. of its new three-axis accelerometer that can cut the data collection time for vibration analysis of rotating equipment by 30-75 percent. The device has an integral magnet for attaching to machines without a stud mount, so is fast to deploy. It measures up to 10kHz in the primary axis and above 3MHz in secondary axes.

This article reports on an announcement made by MicroStrain Inc. that the release of 3DM-GX1, a lightweight orientation sensor that combines the outputs from three angular rate gyros with three orthogonal DC accelerometers and three orthogonal magnetometers. The embedded microprocessor contains a programmable, complimentary filtering algorithm, which blends the static and dynamic outputs of the sensors to provide stabilized pitch, roll, and yaw measurements under dynamic and static conditions.

This article features a broad range of low-cost and low-g dual-axis MEMS sensors introduced by Freescale Semiconductor Inc. The MMA62xxQ family of dual-axis, capacitive, MEMS-based sensors covers the acceleration range of 1.5 to 10 g. The chips contain signal-conditioning circuitry, a single-pole low-pass filter, and temperature-compensation circuitry. Zero-g offset for the full-scale span and the filter's cutoff frequency are factory-set and require no external devices.

Presents information on several instruments and measuring devices as of December 11, 2003. Force-balance angular accelerometers from Columbia Research Labs; In-flow sensors from Turck; PLT-5000 laser-diode-based tachometer from Kernco Instruments; Krautkramer DM4-EDM digital thickness gage from Agfa NDT.

Presents an update on the Sensors Expo, held in Boston, Massachusetts in September 2002, which features advances in sensor technologies. Highlights of the exhibition; Applications for accelerometers; Features of the open loop Hall effect current sensor from Allegro Microsystems; Other sensor device presented at the exhibition.

Provides information on the Series 121A ICP dynamic pressure sensor and Series 3801 capacitive accelerometer released by PCB Piezotronics. Design of the sensor and the accelerometer; Capabilities of the equipment.

The article features Lucas NovaSensor's two new families of ceramic substrate-packaged silicon pressure sensors and accelerometers. The pressure sensors and accelerometers provide a miniature surface-mount approach. The pressure sensor is suited for portable test and calibration equipment, as well as pneumatic control and medical applications. The accelerometers can be used for automotive airbag systems, active suspension systems, anti-lock brake systems, and engine knock sensors.