1. Around the Circuit.
- Author
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Walsh, Barbara
- Subjects
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WIRELESS Internet , *CONTRACTS , *ARTIFICIAL intelligence , *PUBLIC administration , *ENGINEERING design , *SOFTWARE product line engineering , *TECHNOLOGICAL innovations ,SILICON Valley (Santa Clara County, Calif.) - Abstract
The given text provides a series of updates and collaborations in the engineering industry. AMCAD Engineering has been acquired by Dassault Systèmes, L Squared Capital Partners and CogneSense have completed the acquisition of L&J Technologies, and EMITE's over-the-air chambers can now be combined with the R&S CMX500 one-box signaling tester from Rohde & Schwarz. Texas Metering & Device Company and The Antenna Company have collaborated to improve wireless connectivity for off-network smart meters, and Viavi Solutions Inc. and the Telecom Infra Project (TIP) have announced a strategic collaboration to expand testing capabilities. Tech Soft 3D and Spatial have strengthened their strategic alliance, ISE Labs Inc. has opened a second facility in San Jose, California, and Keysight Technologies Inc. has gained validations for the industry's first 5G NR FR1 1024-QAM demodulation test cases. NXP Semiconductors' single-chip NFC and embedded secure element solution, the SN220, has been certified by the Car Connectivity Consortium, and the U.S. Department of Commerce, GlobalWafers America LLC, and MEMC LLC have signed a preliminary memorandum of terms to provide funding for semiconductor wafer production. Raytheon has been awarded two strategic Mentor Protégé Agreement initiatives from the Department of the Navy to support the development of operational AI. The text also mentions a symposium that took place in Cincinnati, Ohio, which featured technical papers, exhibits [Extracted from the article]
- Published
- 2024