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1. New architectures and materials for electronic packaging.

Author

Mena-Garcia, Javier

Subjects
*ELECTRONIC packaging, *ELECTRONIC materials, *PACKAGING materials, *FILLER materials, *ELECTRIC conductivity, *MATERIALS science
Abstract

The article explores architectures and materials for electronic packaging, emphasizing the importance of overcoming limitations posed by the shrinking size of semiconductor chips. Topics include the emergence of three-dimensional (3D) packaging for improved data transfer, the role of ceramic matrix composites (CMCs) with enhanced electrical and thermal properties in electronics, and the use of cold sintering to fabricate CMCs with low dielectric loss and improved thermal conductivity.

Published
2024

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