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We present a novel, simple and widely applicable semi-supervised procedure for anomaly detection in industrial and IoT environments, SAnD (Simple Anomaly Detection). SAnD comprises 5 steps, each leveraging well-known statistical tools, namely; smoothing filters, variance inflation factors, the Mahalanobis distance, threshold selection algorithms and feature importance techniques. To our knowledge, SAnD is the first procedure that integrates these tools to identify anomalies and help decipher their putative causes. We show how each step contributes to tackling technical challenges that practitioners face when detecting anomalies in industrial contexts, where signals can be highly multicollinear, have unknown distributions, and intertwine short-lived noise with the long(er)-lived actual anomalies. The development of SAnD was motivated by a concrete case study from our industrial partner, which we use here to show its effectiveness. We also evaluate the performance of SAnD by comparing it with a selection of semi-supervised methods on public datasets from the literature on anomaly detection. We conclude that SAnD is effective, broadly applicable, and outperforms existing approaches in both anomaly detection and runtime.

As Juno is presently measuring Jupiter's gravitational moments to unprecedented accuracy, models for the interior structure of the planet are putted to the test. While equations of state based on first principles or ab initio simulations have been available and used for the two most abundant elements constituting the envelope, hydrogen and helium, significant discrepancies remain regarding the predictions of the inner structure of Jupiter. The differences are severe enough to clutter the analysis of Juno's data and even cast doubts on the usefulness of these computationally expensive EOSs for the modeling of the interior of Jupiter and exoplanets at large. Using our newly developed equations of state for hydrogen and helium, we asses the ab initio equations of state currently available and establish their efficiency at predicting the interior structure of Jupiter in a two-layers model. By adjusting our free energy parameterization to reproduce previous ab initio EOS behavior, we identify the source of the disagreement previously reported for the interior structure of Jupiter. We further point to area where care should be taken when building EOS for the modeling of giant planets. This concerns the interpolation between the ab initio results and the physical models used to cover the low density range as well as the interpolation of the {\sl ab initio} simulation results at high densities. This sensitivity falls well within the uncertainties of the ab initio simulations. This suggests that hydrogen EOS should be carefully benchmarked using a simple planetary model before being used in the more advanced planetary models needed to interpret the Juno data. We finally provide an updated version of our ab initio hydrogen EOS recently published.

This paper analyzes the role of money in asset markets characterized by search frictions. We develop a dynamic framework that brings together a model for illiquid financial assets `a la Duffie, Garleanu, and Pedersen, and a search-theoretic model of monetary exchange `a la Lagos and Wright. The presence of decentralized financial markets generates an essential role for money, which helps investors re-balance their portfolios. We provide conditions that guarantee the existence of a monetary equilibrium. In this case, asset prices are always above their fundamental value, and this differential represents a liquidity premium. We are able to derive an asset pricing theory that delivers an explicit connection between monetary policy, asset prices, and welfare. We obtain a negative relationship between inflation and equilibrium asset prices. This key result stems from the complementarity between money and assets in our framework., Comment: 22 pages

As a first step toward a multi-phase equation of state for dense water, we develop a temperature-dependent equation of state for dense water covering the liquid and plasma regimes and extending to the super-ionic and gas regimes. This equation of state covers the complete range of conditions encountered in planetary modeling. We use first principles quantum molecular dynamics simulations and its Thomas-Fermi extension to reach the highest pressures encountered in giant planets several times the size of Jupiter. Using these results, as well as the data available at lower pressures, we obtain a parametrization of the Helmholtz free energy adjusted over this extended temperature and pressure domain. The parametrization ignores the entropy and density jumps at phase boundaries but we show that it is sufficiently accurate to model interior properties of most planets and exoplanets. We produce an equation of state given in analytical form that is readily usable in planetary modeling codes and dynamical simulations (a fortran implementation can be found at http://www.ioffe.ru/astro/H2O/). The EOS produced is valid for the entire density range relevant to planetary modeling, for densities where quantum effects for the ions can be neglected, and for temperatures below 50,000K. We use this equation of state to calculate the mass-radius relationship of exoplanets up to 5,000M_Earth, explore temperature effects in ocean and wet Earth-like planets, and quantify the influence of the water EOS for the core on the gravitational moments of Jupiter., Comment: 13 pages, 18 figures. In v.2, Eq.(13) and the value of S_0 are corrected

In this paper we introduce a new way to deal with Grid portals referring to our implementation. L-GRID is a light portal to access the EGEE/EGI Grid infrastructure via Web, allowing users to submit their jobs from a common Web browser in a few minutes, without any knowledge about the Grid infrastructure. It provides the control over the complete lifecycle of a Grid Job, from its submission and status monitoring, to the output retrieval. The system, implemented as client-server architecture, is based on the Globus Grid middleware. The client side application is based on a java applet; the server relies on a Globus User Interface. There is no need of user registration on the server side, and the user needs only his own X.509 personal certificate. The system is user-friendly, secure (it uses SSL protocol, mechanism for dynamic delegation and identity creation in public key infrastructures), highly customizable, open source, and easy to install. The X.509 personal certificate does not get out from the local machine. It allows to reduce the time spent for the job submission, granting at the same time a higher efficiency and a better security level in proxy delegation and management., Comment: 6 pages

Nowadays one of the main obstacles the research comes up against is the difficulty in accessing the required computational resources. Grid is able to offer the user a wide set of resources, even if they are often too hard to exploit for non expert end user. Use simplification has today become a common practice in the access and utilization of Cloud, Grid, and data center resources. With the launch of L-GRID gateway, we introduced a new way to deal with Grid portals. L-GRID is an extremely light portal developed in order to access the EGI Grid infrastructure via Web, allowing users to submit their jobs from whatever Web browser in a few minutes, without any knowledge about the underlying Grid infrastructure., Comment: 6 pages

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A study compared the teaching methods of basal readers to writing/reading integration as they effect reading comprehension. Forty fourth-grade students from an urban area of New England completed the Reading Comprehension Subtest of the Comprehensive Test of Basic Skills (CTBS) for grade 3 as a pretest. A control group of 20 students were instructed throughout the entire fourth-grade year in reading solely with the HBJ Basal Reading Program. The experimental group of 20 students also completed the HBJ Basal Reading Program on the fourth-grade level but additionally were instructed in a wide range of writing activities based on trade books. Both groups were then given the fourth-grade Reading Comprehension Subtest of the CTBS after the nine-month period. The experimental group did not score significantly higher than the control group on the 45 multiple-choice responses based on a variety of comprehension questions. Analysis done with an independent t-test indicated that students who practiced and strengthened their comprehension skills by using writing activities displayed no difference in comprehension skills measured by a multiple-choice format. (Two tables of data are included, 15 references are attached, and appendixes containing statistical analysis, curriculum objectives, and basal reader scope and sequence are provided.) (Author/SR)

NASA plans human exploration near the South Pole of the Moon, and other locations where the environment is extremely cold. This paper reports on the heat transfer performance of a loop heat pipe (LHP) exposed to extreme cold under the simulated reduced gravitational environment of the Moon. A common method of spacecraft thermal control is to use a LHP with ammonia working fluid. Typically, a small amount of heat is provided either by electrical heaters or by environmental design, such that the LHP condenser temperature never drops below the freezing point of ammonia. The concern is that a liquid-filled, frozen condenser would not restart, or that a thawing condenser would damage the tubing due to the expansion of ammonia upon thawing. This paper reports the results of an experimental investigation of a novel approach to avoid these problems. The LHP compensation chamber (CC) is conditioned such that all the ammonia liquid is removed from the condenser and the LHP is nonoperating. The condenser temperature is then reduced to below that of the ammonia freezing point. The LHP is then successfully restarted.

Through an Air Force Research Laboratory sponsored STM program, reliable, low-cost, low-weight, non-hermetic coatings for multi-chip-module(MCK applications were developed. Using the combination of Sandia Laboratory ATC-01 test chips, AvanTeco's moisture sensor chips(MSC's), and silicon slices, we have shown that organic and organic/inorganic overcoatings are reliable and practical non-hermetic moisture and oxidation barriers. The use of the MSC and unpassivated ATC-01 test chips provided rapid test results and comparison of moisture barrier quality of the overcoatings. The organic coatings studied were Parylene and Cyclotene. The inorganic coatings were Al2O3 and SiO2. The choice of coating(s) is dependent on the environment that the device(s) will be exposed to. We have defined four(4) classes of environments: Class I(moderate temperature/moderate humidity). Class H(high temperature/moderate humidity). Class III(moderate temperature/high humidity). Class IV(high temperature/high humidity). By subjecting the components to adhesion, FTIR, temperature-humidity(TH), pressure cooker(PCT), and electrical tests, we have determined that it is possible to reduce failures 50-70% for organic/inorganic coated components compared to organic coated components. All materials and equipment used are readily available commercially or are standard in most semiconductor fabrication lines. It is estimated that production cost for the developed technology would range from $1-10/module, compared to $20-200 for hermetically sealed packages.

Improved qualification standards and test procedures for epoxy adhesives used in assembly of high-reliability hybrid microcircuits listed in new report. Objective of standards to resolve problems in areas of outgassing, bond shear strength, corrosivity, volume resistivity, ionic impurities, electrical stability, and frequency of qualification testing. pp

Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared.

Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation.

Engineering design guidelines enumerate and briefly describe selected adhesive properties. General review of polymeric types of adhesives is included and major types of commercially available adhesives specifically designed for microelectronic use are identified.

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail.

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed.

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits.

Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.

Report describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure.

A systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.

A preliminary investigation was made to determine the feasibility of using adhesive package sealing for hybrid microcircuits. Major effort consisted of: (1) surveying representative hybrid manufacturers to assess the current use of adhesives for package sealing; (2) making a cost comparison of metallurgical versus adhesive package sealing; (3) determining the seal integrity of gold plated flatpack type packages sealed with selected adhesives, thermal shock, temperature cycling, mechanical shock, and constant acceleration test environments; and (4) defining a more comprehensive study to continue the evaluation of adhesives for package sealing. Results showed that 1.27 cm square gold plated flatpack type packages sealed with the film adhesives and the paste adhesive retained their seal integrity after all tests, and that similarly prepared 2.54 cm square packages retained their seal integrity after all tests except the 10,000 g's constant acceleration test. It is concluded that these results are encouraging, but by no means sufficient to establish the suitability of adhesives for sealing high reliability hybrid microcircuits.

High purity pinhole free films /parylene/ applicability as barrier coating to keep semiconductor surface free from moisture, ions and contaminants

Apollo 11 lunar dust and breccia micromorphology and surface characteristics implying weathering processes

Procaryotic and eucaryotic nannofossils localized in prePaleozoic microflora, noting radiometric age and association with stromatolites

Microstructure of Proterozoic nannofossils bracketed by dated granitic events compared with living Eucapsis of blue green Chroococcaceae algal family

The initial results of a study directed to the task of selecting suitable evaluation tests which can form the basis for guidelines for electrically insulated adhesives are given. The properties of adhesives considered to be of major importance for the proposed application are enumerated, with brief comments. Specific tests to determine the chemical and electrolytic corrosivity of adhesives to commonly used metallization systems, their long-term outgassing after cure, and their bond strengths under a variety of conditions are defined and discussed in detail.

Although it is generally accepted that the use of adhesives in the assembly of hybrid microcircuits offers advantages over other bonding methods, there currently does not exist a set of guidelines for the selection of adhesives which will insure that hybrid microcircuits assembled with them will meet the long use-life, high-reliability requirements of electronic equipment for space applications. This study was directed to the identification of the properties of electrically insulative adhesives that potentially could cause problems in such an application, and to the development of evaluation tests to quantify these properties and thus form the basis for establishing suitable guidelines and, ultimately, specifications. Bond strength, outgassing after cure, and corrosivity were selected for detailed attention since they are considered to be especially critical. Introductory discussion includes enumeration and brief comments on the properties of adhesives considered to be important for the proposed application, a general review of polymeric types of adhesives, and identification of the major types of adhesives commercially available and specifically designed for microelectronic use. The specific tests developed to evaluate bond strength, outgassing after cure, and corrosivity are discussed in detail, and comparative results obtained for selected adhesives representative of the major types are given.

The most favorable sites in which to study the associations between stromatolites and the algae responsible for them are places where a variety of stromatolites of possibly early diagenetic or primary silica occupy a layer of substantial thickness of little metamorphosed ancient sediments. One such place is in northwestern Queensland, Australia. Five cases of association between stromatolites and blue-green algal nannofossils were observed within a 100-m sequence of carbonate rocks in that area.