1. CHF3Plasma Treatment of Si Field Emitter Arrays For No Damage Vacuum Packaging
- Author
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Masayoshi Nagao, Masayoshi Nagao, Hisao Tanabe, Hisao Tanabe, Takashi Matsukawa, Takashi Matsukawa, Seigo Kanemaru, Seigo Kanemaru, and Junji Itoh, Junji Itoh
- Abstract
Si field emitter arrays (FEAs) are promising cold cathodes for field emission displays (FEDs). The emission current from the Si FEAs, however, is known to decrease significantly after the vacuum-packaging process based on the frit sealing technique. In this work, we have investigated the mechanism of the current decrease and found that CHF3plasma treatment of the tip surface was sufficiently effective to prevent the problem. In the experiment, the Si FEAs were exposed to the CHF3plasma for 15 s and then treated by the same process as that for the frit sealing at various temperatures. No changes in the emission current were observed before and after the frit sealing process at temperatures up to 430°C. Details of the CHF3plasma treatment are described.
- Published
- 2000
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