11 results on '"LINDNER, PAUL"'
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2. (Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
3. Integrating MEMS devices using low-temperature wafer bonding
4. Taking nanotechnology to market: Solid State Technology asked industry experts to discuss how semiconductor companies can use what they already know to commercialize nanotechnology
5. Wafer Bonding for Backside Illuminated Image Sensors
6. Low Temperature Bonding with Thin Wafers for 3D Integration
7. Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications
8. Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes
9. IRIS: an Infrared Imager and Spectrometer for the Anglo-Australian Telescope
10. ML runner
11. Plasma Activated Wafer Bonding as an Alternative to Standard Wafer Bonding Processes
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