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1. New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method

Author

Takuji Matsumoto, Takuji Matsumoto, Masakazu Satoh, Masakazu Satoh, Katsuyuki Sakuma, Katsuyuki Sakuma, Hiroyuki Kurino, Hiroyuki Kurino, Nobuaki Miyakawa, Nobuaki Miyakawa, Hikotaro Itani, Hikotaro Itani, and Mitsumasa Koyanagi, Mitsumasa Koyanagi

Abstract

A new three-dimensional (3D) wafer bonding technology using the adhesive injection method has been proposed, in order to realize a real-time micro-vision system and a real shared memory. Several key technologies for 3D LSI, such as deep trench formation for buried interconnection, wafer grinding and chemical-mechanical polishing, wafer alignment and wafer bonding using the adhesive injection method, have been developed.

Published
1998
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