1. Understanding Nanoscale Thermal Conduction and Mechanical Strength Correlation in High Temperature Ceramics With Improved Thermal Shock Resistance for Aerospace Applications
- Author
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NOTRE DAME UNIV IN, Tomar, Vikas, Renaud, John E, NOTRE DAME UNIV IN, Tomar, Vikas, and Renaud, John E
- Abstract
Ceramics and semiconductors are an integral part of today s energy devices. This research addresses conductive heat transfer issues in such materials using a combination of classical and quantum mechanical atomistic simulations. For any kind of thermal system, thermal stress and thermal conduction cannot be decoupled. Such analyses have to be performed together. This research also focuses on understanding how mechanical strength gets affected by thermal conduction and vice-versa. We have highlighted important role played by electronic thermal conductivity in overall thermal conduction across interfaces. This is the first time ever, quantum simulations of electronic and phononic thermal conductivity of any material system have been reported. We have performed first ever measurements of nanoscale and microscale high temperature creep in a ceramic. Such measurements could lead to significant advances in tunable thermal protection systems operating at temperatures ranging from very low to ultra-high. We have proven for the first time that materials with biomimetic phase morphology have thermal conductivity values independent of strain. This finding has strong implication for developing materials with thermal properties independent of applied stress., Prepared in cooperation with Purdue University, West Lafayette, IN. The original document contains color images.
- Published
- 2010