1. Automated System Partitioning for Efficient 3D Circuit Integration
- Author
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Milojevic, Dragomir, Goossens, Joël, Mühlberg, Jan Tobias, Paolillo, Antonio, Thoma, Yann, Venugopal, Priya, Vivet, Pascal, Delhaye, Quentin, Milojevic, Dragomir, Goossens, Joël, Mühlberg, Jan Tobias, Paolillo, Antonio, Thoma, Yann, Venugopal, Priya, Vivet, Pascal, and Delhaye, Quentin
- Abstract
A Venn diagram comparing a computer, a car, an industrial robot and smart toaster would point to one piece of technology: the integrated circuit, or IC. Since the mid-20th century, it has grown omnipresent, evermore integrated and denser. The consumers' demand and industry relentless drive for more performance pushes the traditional technology to its last ditch. A short to mid-term solution to keep the trend going would be to stack layers of components, turning the IC 3D.If there are several tiers where elements are placed, one should take a decision regarding which component will occupy which layer, an endeavour regarded as a partitioning problem. It can be tackled by hand, but the size and complexity of modern systems require an automated approach so that the resulting partitions can be generated in accordance with optimisation objectives that tend to produce efficient results. This leads to automated system partitioning for efficient 3D circuit integration.Even though the problem has been studied for the past couple of decades, there is still a lot of open wondering: What is the grain at which we should consider the partitioning decision; should we consider each component individually or group them somehow beforehand? What is a good 3D partition and how does the hypergraph representation of the circuit impact its quality? How can we efficiently leverage information from a regular 2D circuit to take a partitioning decision? Is there an established advantage to automatically partition a system compare to a manual operation?To tackle those problems and achieve an automated system partitioning, we studied and developed a suite of methods that ingests a 2D description of a circuit and produces a 3D representation that can be further processed into a functional 3D IC.The proposed methodology leverages the information of a 2D placement by (1) extracting the design and its interconnectivity, (2) clustering the circuit to keep elements together as we deem more beneficial, Doctorat en Sciences de l'ingénieur et technologie, info:eu-repo/semantics/nonPublished
- Published
- 2024