Search

Your search keyword '"Packaging Density"' showing total 1 results
Start Over Descriptor "Packaging Density" Publication Type Electronic Resources
1 results on '"Packaging Density"'

1. High-Performance TSV Architecture for 3-D ICs

Author

Daneshtalab, M., Ebrahimi, M., Liljeberg, P., Plosila, J., Tenhunen, Hannu, Daneshtalab, M., Ebrahimi, M., Liljeberg, P., Plosila, J., and Tenhunen, Hannu

Abstract

Three-dimensional integrated circuits (3-D ICs) outperform traditional planar ICs in terms of performance, packaging density, interconnection power consumption, and functionality. Since the performance of 3-D ICs employing Through Silicon Vias (TSVs) depends on vertical interlayer interconnects, in this paper we present a high-performance bus architecture for TSVs., QC 20120208Part of proceedings ISBN 978-076954076-4

Published
2010
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results