1. Active metal brazing of silicon nitride ceramics using a Cu-based alloy and refractory metal interlayers
- Author
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National Aeronautics and Space Administration (US), Martínez Fernández, J., Asthana, R., Singh, M., Valera, F. M., National Aeronautics and Space Administration (US), Martínez Fernández, J., Asthana, R., Singh, M., and Valera, F. M.
- Abstract
Silicon nitride/silicon nitride joints with refractory metal (W and Mo) interlayers were vacuum brazed using an active braze, Cu-ABA (Cu-3Si-2Al-2.25Ti, wt%), and two interlayer arrangements in a double-lap offset configuration: SiN/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/SiN and SiN/Cu-ABA /SiN. Titanium segregated at the SiN/Cu-ABA and Mo/Cu-ABA interfaces, but not at the W/Cu-ABA interface. The room-temperature compression-shear strength values of SiN/Cu-ABA/SiN and SiN/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/SiN joints were 118±24 MPa and 22±5 MPa, respectively. Elevated-temperature compression tests showed that SiN/Cu-ABA/SiN joints had strength of 31±6 MPa at 1023 K and 17±3 MPa at 1073 K. Likewise, SiN/Cu-ABA/W/Cu-ABA/Mo/Cu-ABA/SiN joints had strength of 19±4 MPa at 1023 K and 13±3 MPa at 1073 K. Knoop microhardness profiles revealed hardness gradients across the joints. The effect of joint microstructure and test configuration on the mechanical behavior is discussed.
- Published
- 2016