23 results on '"Wang, Huayan"'
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2. Residual stress measurement of build-up layer in silicon wafers
3. Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation
4. Finite Element Modeling Strategies for Studying Mechanical Design Tradeoffs in Heterogeneously Integrated Packages
5. CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture
6. Camera-Space Hand Mesh Recovery via Semantic Aggregation and Adaptive 2D-1D Registration
7. Lidless and lidded Flip Chip Packages for Advanced Applications
8. Shock Performance Enhancement of a Container for Rack Server
9. The Effect of Misaligned Passive Component on Fatigue Life of Solder Joints and Solder Shape
10. The effect of solder paste volume on solder joint shape and self-alignment of passive components
11. Investigation of underfilling BGAs packages – Thermal fatigue
12. A Comprehensive Study of Electromigration in Lead-free Solder Joint
13. Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs
14. Time 0 Void Evolution and Effect on Electromigration
15. Product Level Design Optimization for 2.5D Package Pad Cratering Reliability During Drop Impact
16. An Assessment of Electromigration in 2.5D Packaging
17. A Study of Substrate Models and Its Effect On Package Warpage Prediction
18. Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
19. Teaching Compositionality to CNNs
20. In-Situ Warpage Characterization of BGA Packages with Solder Balls Attached During Reflow with 3D Digital Image Correlation (DIC)
21. Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging
22. Multi-level inference by relaxed dual decomposition for human pose segmentation
23. Achieving bounded fairness for multicast and TCP traffic in the Internet.
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