43 results on '"Takagi, Hideki"'
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2. Template Stripping of Au from Polyimide Film for Smoothing of Bonding Surface
3. Direct bonding of germanium and diamond substrates by hydrophilic bonding
4. Measurement of propulsive forces in swimming by using a swimming humanoid robot
5. Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration
6. Room-Temperature bonding of AlN ceramic and Si semiconductor substrates for improved thermal management
7. Direct bonding of diamond and Si substrates using NH3/H2O2 cleaning
8. High-power AlGaN UVC LEDs using PhC reflector p-contact layers
9. Formation of smooth Au surfaces produced by multiple thin-film transfer process based on template stripping for low-temperature bonding
10. Direct Bonding of Diamond and Si Substrates at Low Temperatures Under Atmospheric Conditions
11. Evaluation of electrical and thermal properties of single crystalline diamond with large area of $18\ \mathbf{mm}\times 18\ \mathbf{mm}$ for power module
12. Room-temperature bonding of organic films using ultrathin Au intermediate layers for organic integrated optical devices
13. Germanium Layer Transfer with Low Temperature Direct Bonding and Epitaxial Lift-off Technique for Ge-based monolithic 3D integration
14. Room-Temperature Wafer Bonding with Titanium Thin Films Based on Formation of Ti/Si Amorphous Layers
15. Room-temperature pressureless wafer sealing using ultrathin Au films activated by Ar plasma
16. Room temperature bonding of smooth Au surface of electroformed Cu substrate in atmospheric air
17. Wafer-scale Au-Au surface activated bonding using atmospheric-pressure plasma
18. LEE enhancement in AlGaN UVC LED using photonic crystal reflector fabricated on p-GaN contact layer (Conference Presentation)
19. Surface analysis of argon and oxygen plasma-treated gold for room temperature wafer scale gold-gold bonding
20. Room-Temperature Wafer Bonding Using Smooth Au Thin Films for Integrated Plasmonic Devices
21. Surface activated bonding of Au/Ta layers after degas annealing for MEMS packaging
22. Comparison of Active Drag Using the MRT-Method and the MAD-System in Front Crawl Swimming
23. Surface activated room-temperature bonding in Ar gas ambience for MEMS encapsulation
24. Study of wind turbine generation system shutdown using atmospheric electric field potential
25. Room-temperature bonding for hermetic sealing using electroplated Au seal rings with ultra-smooth surface
26. 100 mm diameter mono-crystalline 4H-SiC/polycrystalline-SiC bonded wafers fabricated by SAB for power device
27. Room temperature wafer scale bonding of electroplated Au patterns processed by surface planarization
28. A polymer mems mirror for on-demand light distribution fabricated by injection molding and transfer of printed layers
29. Size-free MEMS-IC high-efficient integration by using carrier wafer with self-assembled monolayer (SAM) fine pattern
30. High-efficient and high-accurate chip to wafer bonding for size-free MEMS-IC integration by using fine patterned self-assembled monolayer
31. Chip to wafer temporary bonding with self-alignment by patterned FDTS layer for size-free MEMS integration
32. Artifacts of the AFM image due to the probe controlling parameters
33. Evaluation of adsorption capacity of single-walled carbon nanotubes for application to micro gas preconcentrators
34. III-V-semiconductor-on-insulator MISFETs on Si with buried SiO2 and Al2O3 layers by direct wafer bonding
35. Characterization of bonding interface prepared by room temperature bonding after flattening by thermal imprint process.
36. Development and process optimization of C2W self-alignment & temporary bonding system.
37. Large-scale and flexible MEMS-IC integration by using carrier wafer.
38. Polymer MOEMS mirror by all vacuum-less processes combining printed film and injection molding replication.
39. Relationships between Interface Structures and Electrical Properties in the High-k/III–V System.
40. Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection
41. Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection.
42. InGaAsP Laser on GaAs Fabricated by the Surface Activated Wafer Direct Bondind Method at Room Temperature
43. Wafer Direct Bonding at Room Temperature by Means of the Surface Activated Bonding
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