11 results on '"Tai Chong Chai"'
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2. Evaluation of support wafer system for thin wafer handling.
3. 3D stacking by hybrid bonding with low temperature solder.
4. Electrochemical migration study of fine pitch lead free micro bump interconnect.
5. Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer.
6. Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure.
7. Mapping of solder mask covered interconnects on high density printed circuit board.
8. Structural optimization of fine pitch, large die flip chip package.
9. Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA.
10. Reliability studies of a through via silicon stacked module for 3D microsystem packaging.
11. Assembly challenges of high density large fine pitch lead-free flip chip package.
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