105 results on '"Schuster C"'
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2. Effect of augmented radiofrequency ablation in ex vivo pancreatic tissue using endoscopic ultrasound needle with sugar solution as a booster. Towards an improved pancreatic cancer surgery
3. Low-Frequency Modal Extrapolation and Regularization for Full-Bandwidth Macromodeling of Electromagnetic Structures
4. P02 - Ethanol-sensitive Hydrogele auf plasmonischen Sensorsubstraten: Einfluss des Quellvorgangs auf die Brechzahländerung
5. D6.4 Monitoring Inkjet Printer Condition via Image Analysis of Printed Patterns
6. P4.13 - Zeitaufgelöste Messungen mit einem LSPR-Sensorsystem am Beispiel des Spurenstoffs Diclofenac
7. C5.1 Inline Inspection of Ceramic Tape Casting Processes by Means of Optical, Eddy Current and Machine Learning Methods
8. D5.1 Image-Based Predictive Maintenance Concept for Inkjet Printing of Ceramic Inks
9. Using Orbital Angular Momentum (OAM) Modes on Multi-Conductor Cables for Crosstalk Mitigation
10. Characterization of Liquid Crystals Using a Temperature-Controlled 60 GHz Resonator
11. Reconfigurable GaN Digital Tx Applying BST Bandpass Filter
12. Characterization and Modeling of Epitaxially Grown BST on a Conducting Oxide Electrode
13. Ferroelectrics for Tunable High-Power Applications
14. Integral equation methods (MoM) in numerical modeling
15. Investigation of Thermohydraulic Models for Condensation and Boiling in Passive Safety Systems
16. Extension of the Contour Integral Method for the modeling of TE scattering in two-dimensional photonic structures using the duality principle
17. Tunable dielectric delay line phase shifter based on liquid crystal technology for a SPDT in a radiometer calibration scheme at 100 GHz
18. Tunable microwave component technologies for SatCom-platforms
19. Cross-functional photoresists and photopolymers enhancing micro- and nanofabrication.
20. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method
21. Plenary Talk 3 - Optical nanosensor technology – from basic research to industrial applications
22. Laser-Induced Plasma Dynamics Imaged by Femtosecond In-Line Holography
23. Modeling of mutual coupling between coaxial probes in flat metallic casings using the contour integral method.
24. Extensions to the contour integral method for efficient modeling of TM scattering in two-dimensional photonic crystals
25. Applicability of the thin sheet approximation to the analysis of EM emission from coated PCBs
26. Investigation of field coupling into a carbon fiber aircraft fuselage with the method of moments
27. Recent developments of via and return current path modeling
28. Novel multiport probing fixture for high frequency measurements in dense via arrays
29. Photovoltaic properties of Si nanostructure based solar cells fabricated on quartz
30. 3D nanofabrication by reverse contact UV nanoimprint lithography
31. Nanoimprinted photonic crystals enhanced light emitters via surface plasmon
32. Practical Considerations in the Modeling and Characterization of Printed-Circuit Board Wiring
33. Chip-to-chip optical interconnects
34. Leakage Reduction at Architectural Level
35. Terabus: a chip-to-chip parallel optical interconnect
36. A relativistic outflow model: Analytical solutions
37. Terabus: A Waveguide-Based Parallel Optical Interconnect
38. Novel multiport probing fixture for high frequency measurements in dense via arrays.
39. Custom-made calibration standards for measurements of multilayer substrates.
40. Numerical and experimental investigations on a metallic fuselage model with apertures.
41. Fast parametric pre-layout analysis of signal integrity for backplane interconnects.
42. Electrical performance of a multiport interposer for measurements of dense via arrays.
43. Effect of via stubs on the TRL calibration technique for measurement of embedded multilayer structures.
44. Crosstalk analysis in high density connector via pin fields for digital backplane applications using a 12-port vector network analyzer.
45. Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards.
46. Non-uniform currents on vias and their effects in a parallel-plate environment.
47. Multiport measurement and deembedding techniques for crosstalk study in via arrays.
48. Effect of mixed-reference planes on single-ended and differential links in multilayer substrates.
49. Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
50. Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects.
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