63 results on '"Rusanen, A."'
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2. A Low-Power Push-Push D-Band VCO with 11.6% FTR utilizing Back-gate Control in 22nm FDSOI.
3. Towards a Deeper Understanding of Sleep Stages through their Representation in the Latent Space of Variational Autoencoders.
4. Towards securely migrating webassembly enclaves.
5. Broadband Analog Predistortion Circuits Utilizing Derivative Superposition.
6. A portfolio model for the teaching and learning of GIS competencies in an upper secondary school: A case study from a finnish geomedia course
7. Ka-Band Stacked Power Amplifier on 22 nm CMOS FDSOI Technology Utilizing Back-Gate Bias for Linearity Improvement.
8. Proxy Mobile IPv6-Based Seamless Handover.
9. A Low-Power Push-Push D-Band VCO with 11.6% FTR utilizing Back-gate Control in 22nm FDSOI
10. Forest genetic resources and forest reproductive material at the crosssection of multiple policy domains in Europe
11. Towards a Deeper Understanding of Sleep Stages through their Representation in the Latent Space of Variational Autoencoders
12. Self-Organizing Maps as Traveling Computational Templates.
13. Neural Network Templates and Their Interpretation.
14. 108 and 124 GHz Fundamental VCOs with 21% and 7% DC-to-RF Efficiency in 22nm CMOS FDSOI
15. Ka-Band Orthogonal Load-Modulated Balanced Amplifier in 22 nm CMOS FDSOI
16. Experimental Development of a Prototype for Mobile Environmental Information Systems (MEIS).
17. On The Scope of Mechanistic Explanation in Cognitive Sciences.
18. Integration of Dichotically and Visually Presented Speech Stimuli.
19. What, When and How do the Models of Conceptual Change Explain?
20. Towards securely migrating webassembly enclaves
21. Modeling Cognition: How Fiction Relates to Fact.
22. Broadband Analog Predistortion Circuits Utilizing Derivative Superposition
23. Reliable Smart Molded Structures
24. Ka-Band TDD Front-End with Gate Shunt Switched Cascode LNA and Three-Stack PA on 22nm FDSOI CMOS Technology
25. Paradox of openness: knowledge sharing-protection tension in ecosystems.
26. Ka-Band Stacked Power Amplifier on 22 nm CMOS FDSOI Technology Utilizing Back-Gate Bias for Linearity Improvement
27. Injection Molded Structural Electronics Brings Surfaces to Life
28. Broadband Linearization Technique for mmWave Circuits
29. Component Packages for IMSE™ (Injection Molded Structural Electronics)
30. Neural Network Templates and Their Interpretation
31. Self-Organizing Maps as Traveling Computational Templates
32. Modelling Size-Selected Growth of Nanodots by Using Reaction Kinetic Approach.
33. Factors that influence ionic migration on printed wiring boards.
34. An investigation of sealant materials for display modules subjected to temperature and humidity conditions.
35. High-density interconnections in mobile phones using ACF.
36. MEMS sensor packaging using LTCC substrate technology
37. MEMS sensor packaging using LTCC substrate technology.
38. Modelling of ICA creep properties.
39. Main characteristics of a miniaturized multipurpose infrared spectrometer
40. Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems
41. Electrically tunable NIR spectrometer
42. Main characteristics of a miniaturized multipurpose infrared spectrometer.
43. Electrically tunable NIR spectrometer.
44. Packaging induced stresses in a packaged micromechanical microphone.
45. Adhesives as a thermomechanical stress source-comparing silicones to epoxies.
46. Adhesive flip chip bonding in a miniaturised spectrometer.
47. Reasons for using lead-free solders rather than isotropically conductive adhesives in mobile phone manufacturing.
48. Roadmap “Adhesives Technologies in Automotive and Harsh Environment Applications”.
49. Roadmap "Adhesives Technologies in Automotive and Harsh Environment Applications"
50. An investigation of sealant materials for display modules subjected to temperature and humidity conditions
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