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In the contemporary engineering landscape, the dynamics of magnetic repulsion have emerged as a pivotal area of exploration, given their potential to revolutionize applications requiring precise levitation and force interactions. Despite the recognized potential, a comprehensive understanding of how magnet dimensions and thermal treatments influence these dynamics remained elusive. Addressing this gap, our research focused on axially magnetized Neodymium N52 ring-shaped magnets, systematically varying their external dimensions while maintaining consistent thickness and internal radius. Additionally, the magnets underwent a heating regimen up to 300 degrees Celsius, simulating real-world operating conditions. Our findings revealed a direct correlation between the external radius and repulsion force, with magnets exhibiting an external radius of 50 mm achieving a peak force of 23.8 N. Furthermore, the thermal treatments appeared to bolster the magnetic repulsion capabilities, suggesting an intricate interplay between magnet dimensions and their thermal history. This study, therefore, not only elucidates the nuanced behaviour of treated magnets but also provides a foundation for harnessing their capabilities in future engineering applications. [ABSTRACT FROM AUTHOR]

Carbon Dioxide (CO2) Laser Machining has been in high demand as compared to other high-end conventional machining processes as it is capable of producing super precision cutting with a non-contact technology. The objective of this research is to establish mathematical model to predict laser cut surface roughness of the P-type silicon wafer processed with assistive Pyrex glass. The design parameters employed in this fractional factorial design of experiment were laser power, cutting speed, and pulse frequency. P-type silicon wafers were machined using assistive Pyrex glass to observe if it gives significant effect on the cut quality. Commercially available statistical package namely Response Surface Methodology (RSM) was used to optimise the design parameters and establish the predictive model. The findings reveal that, Pyrex glass assisted laser machining has significant contribution in the laser processing of P-type silicon wafer. [ABSTRACT FROM AUTHOR]